UCD0J330MCL1GS

CAP ALUM 33UF ±20% 6.3V SMD
Part Description

33 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,451 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCD
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance33 µFECCNEAR99
ESRN/AHeight Seated (Max)6.8 mmHTS Code8532.22.0020
Impedance700 mOhmLead SpacingN/ALifetime @ Temp2000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency160 mA @ 10 kHzRipple Current Low Frequency80 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.8 x 5 mmSurface Mount Land Size5.3 x 5.3 mm
Tolerance-20%~20%Voltage6.3 V

Overview of UCD0J330MCL1GS – 33 µF, 6.3 V Chip-Type Low-Impedance Aluminum Electrolytic Capacitor

The UCD0J330MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor in an SMD can package, optimized for surface mounting on high-density printed circuit boards. It delivers 33 µF capacitance at a 6.3 V rated voltage with a compact 5.8 × 5.0 mm footprint.

Designed for demanding environments, this part supports an operating temperature range from -55 °C to +105 °C, carries AEC-Q200 qualification, and is RoHS compliant, making it suitable for automotive electronics and other applications that require robust, board-level energy storage.

Key Features

  • Core Electricals — 33 µF capacitance with a 6.3 V rated voltage and ±20% capacitance tolerance (measured at 120 Hz, 20 °C).
  • Low Impedance — Specified impedance of 700 mΩ, supporting improved ripple handling and stability in power applications; ripple current ratings of 80 mA at 120 Hz and 160 mA at 10 kHz are provided.
  • Temperature & Endurance — Operating range from -55 °C to +105 °C and a specified lifetime of 2000 hours at 105 °C.
  • Package & Mounting — Chip-type SMD can (radial can - SMD) sized L: 5.8 × D: 5 mm with recommended land pattern 5.3 × 5.3 mm; compatible with automatic mounting machines fed with carrier tape.
  • Reliability & Compliance — AEC-Q200 qualified and RoHS directive (2011/65/EU, (EU)2015/863) compliant.
  • Polarized — Conventional polarized electrolytic construction for board-level decoupling and smoothing.

Typical Applications

  • Automotive Electronics — Suited for automotive modules where AEC-Q200 qualification and a wide operating temperature range (‑55 °C to +105 °C) are required.
  • High-Density PCB Assemblies — Chip-type SMD can and small 5.8 × 5.0 mm footprint make it appropriate for space-constrained, densely populated boards.
  • Automated Surface-Mount Production — Designed for compatibility with automatic mounting machines and carrier-tape feeding to streamline assembly.

Unique Advantages

  • AEC-Q200 Qualification: Provides documented series-level qualification for designs targeting automotive and other high-reliability markets.
  • High Temperature Capability: Rated for operation up to +105 °C with a 2000-hour endurance specification at that temperature.
  • Low Impedance Performance: 700 mΩ impedance combined with specified ripple current ratings (80 mA @ 120 Hz, 160 mA @ 10 kHz) supports effective smoothing and decoupling on power rails.
  • Compact SMD Can: 5.8 × 5.0 mm package with recommended 5.3 × 5.3 mm land pattern reduces PCB area while enabling robust soldered connections.
  • Production-Friendly Packaging: Compatible with carrier-tape automated placement, simplifying high-volume surface-mount assembly.
  • Standards Compliance: RoHS directive compliant for regulatory and environmental compatibility.

Why Choose UCD0J330MCL1GS?

UCD0J330MCL1GS combines low impedance, compact SMD packaging, and high-temperature endurance in a single chip-type aluminum electrolytic capacitor. Its AEC-Q200 qualification and RoHS compliance make it a practical choice for engineers developing board-level power filtering and decoupling solutions where reliability and thermal robustness matter.

This part is ideal for designs that demand a small footprint, automated assembly compatibility, and verified performance up to +105 °C—particularly in automotive electronics and other demanding environments. Its clear, series-derived specifications help simplify component selection and risk assessment during design and qualification.

Request a quote or contact sales to obtain pricing, lead times, and sample availability for UCD0J330MCL1GS.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


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