UCD0J331MCL1GS

The UCD0J331MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount use on high-density PCBs. It delivers 330 µF nominal capacitance at a 6.3 V rating in a compact φ6.3 × 7.7 mm SMD can and is supplied in embossed carrier taping for automated assembly.

Targeted for demanding electronic power applications, this capacitor combines a wide operating temperature range and AEC-Q200 qualification with measured low-frequency and high-frequency ripple current capability for reliable decoupling and bulk energy storage in space-constrained assemblies.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance rated at 6.3 V with a tolerance of -20% to +20%.
• Low Impedance — Chip-type construction with a specified tangent of loss angle (tan δ) of 0.26 measured at 20°C, 120 Hz, supporting effective AC performance.
• Ripple Current Capability — Low-frequency ripple current 145 mA (120 Hz) and high-frequency ripple current 290 mA (10 kHz), enabling both bulk filtering and higher-frequency decoupling tasks.
• Leakage & Endurance — Measured leakage current 20.79 µA and rated endurance of 2000 hours at 105°C.
• Temperature Range — Operates from -55°C to +105°C for wide environmental tolerance.
• Package & Mounting — Surface-mount radial can (φ6.3 × 7.7 mm) with recommended land size 6.6 × 6.6 mm; supplied in embossed carrier taping compatible with automatic mounting machines.
• Compliance & Qualification — RoHS compliant and AEC-Q200 qualified.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and wide temperature range make this capacitor suitable for use in automotive electronic modules requiring SMD bulk capacitance.
• Surface-mount power decoupling — Chip-type low impedance and specified ripple currents support bulk decoupling on high-density printed circuit boards.
• Compact power modules — 330 µF in a φ6.3 × 7.7 mm package provides high capacitance for space-constrained power supply sections.
• Automated assembly lines — Embossed carrier taping and SMD form factor enable placement by automatic mounting equipment for high-volume production.

Unique Advantages

• High capacitance in a small SMD can — 330 µF in a φ6.3 × 7.7 mm package reduces board area for compact designs.
• Measured AC performance — Defined tan δ (0.26 at 6.3 V, 120 Hz, 20°C) and specified ripple currents (145 mA @120 Hz, 290 mA @10 kHz) give designers quantifiable filtering performance.
• Robust thermal range and endurance — Rated for -55°C to +105°C with 2000 hours endurance at 105°C to support long-term operation in elevated temperatures.
• Automotive-ready qualification — AEC-Q200 rating supports selection for automotive electronic subsystems requiring qualified components.
• Production-friendly packaging — Embossed carrier taping and SMD form factor streamline placement on automated assembly equipment.
• Compliant and traceable — RoHS compliance for regulatory alignment.

Why Choose UCD0J331MCL1GS?

UCD0J331MCL1GS combines a compact chip-type SMD can with measurable low-impedance behavior and defined ripple current ratings, delivering reliable bulk capacitance in space-limited power designs. Its AEC-Q200 qualification, wide -55°C to +105°C operating range and 2000-hour endurance at 105°C make it suitable for applications that require durability and predictable performance over time.

This part is well suited to engineers and procurement teams designing automotive and other demanding electronic systems that need a compact, production-ready SMD electrolytic capacitor with clear electrical and mechanical specifications.

Request a quote or contact sales to discuss availability, lead times and sample quantities for UCD0J331MCL1GS.