UCD0J331MCS1GS

The UCD0J331MCS1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount applications. It provides 330 µF capacitance at a 6.3 V rating in a compact φ6.3 × 7.7 mm can suitable for high‑density PCB layouts.

Engineered for robust operation, the device supports an operating temperature range of −55 °C to 105 °C, carries AEC‑Q200 qualification, and is supplied in embossed carrier tape for automated placement—making it appropriate for demanding, assembly‑driven production environments.

Key Features

• Core Electricals — 330 µF capacitance with a 6.3 V rated voltage and ±20% capacitance tolerance (measured at 120 Hz, 20 °C).
• Low Impedance Performance — Chip‑type, low‑impedance construction with a maximum tanδ of 0.26 at 6.3 V (120 Hz, 20 °C), optimized for SMD use.
• Ripple Current Capability — Specified low‑frequency ripple current of 145 mA (120 Hz) and high‑frequency ripple current of 290 mA (10 kHz), supporting dynamic load conditions.
• Leakage Current — Measured leakage current of 20.79 µA after rated voltage application, suitable for many precision and power applications requiring controlled leakage.
• Reliability & Endurance — Lifetime endurance specified at 2000 hours at 105 °C; meets endurance limits for capacitance change, tanδ and leakage current after the specified test.
• Temperature Range — Wide operating range from −55 °C to 105 °C to accommodate varied thermal environments.
• Package & Mounting — Surface‑mount radial can (φ6.3 × 7.7 mm) with recommended land pattern 6.6 × 6.6 mm; supplied on embossed carrier tape suitable for automatic mounting machines.
• Qualification & Compliance — AEC‑Q200 qualified and RoHS compliant; vibration resistant construction for mechanically demanding assemblies.
• Polarized Device — Polarized aluminum electrolytic capacitor; observe polarity during placement and assembly.

Typical Applications

• Automotive Electronics — Designed for automotive applications where AEC‑Q200 qualification is required.
• High‑Density Surface‑Mount PCBs — Chip‑type format specifically intended for use on high‑density printed circuit boards.
• Automated Assembly Lines — Supplied in embossed carrier tape and compatible with automatic mounting machines for efficient SMT production.

Unique Advantages

• Low‑impedance design: Delivers reduced impedance characteristics (specified tanδ) for improved AC performance in SMD form factors.
• Automated‑assembly ready: Embossed carrier tape packaging and chip‑type construction simplify placement on modern SMT lines.
• AEC‑Q200 qualification: Meets automotive grade qualification requirements for designs that require verified component reliability.
• Compact footprint: φ6.3 × 7.7 mm can and small recommended land pattern enable use on space‑constrained boards.
• Extended temperature and endurance: Rated for −55 °C to 105 °C operation with a 2000‑hour endurance specification at 105 °C for long‑term stability under elevated temperatures.
• Vibration resistant: Construction suited to environments where mechanical robustness is needed.

Why Choose UCD0J331MCS1GS?

UCD0J331MCS1GS is positioned for designs that require a compact, low‑impedance aluminum electrolytic capacitor with verified AEC‑Q200 qualification and RoHS compliance. Its combination of 330 µF capacitance at 6.3 V, measurable ripple current capability, controlled leakage, and vibration resistance makes it a practical choice for high‑density, assembly‑driven production in regulated environments.

Choose this part when you need an SMD aluminum electrolytic solution that balances compact size, temperature endurance up to 105 °C, and automated‑assembly compatibility for stable, repeatable manufacturing and long‑term operation.

If you would like pricing, lead‑time information, or a formal quote for UCD0J331MCS1GS, please submit a request or contact our sales team to request a quote or submit an RFQ.