UCD0J331MCL6GS

The UCD0J331MCL6GS is a chip-type aluminum electrolytic capacitor designed for surface-mount applications. It provides 330 µF nominal capacitance at a 6.3 V rating in a compact φ8 × 6.2 mm package, delivering low impedance and targeted ripple handling for dense PCB designs.

Built to meet demanding temperature and reliability requirements, this part is AEC-Q200 qualified and RoHS compliant, making it suitable for automotive and other high-reliability embedded electronics where space, thermal endurance and automated assembly are priorities.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance with a rated voltage of 6.3 V and a tolerance of −20% to +20%.
• Low Impedance Performance — Rated impedance of 260 mΩ and a tangent of loss angle (tan δ) of 0.26 (measured at 20°C, 120 Hz), supporting stable performance under AC conditions.
• Ripple Handling — Low-frequency ripple current 150 mA (120 Hz) and high-frequency ripple current 300 mA (10 kHz) to address power-supply filtering and decoupling needs.
• Leakage Current — Specified leakage current of 20.79 µA for predictable bias behavior in low-leakage designs.
• Temperature & Endurance — Operating temperature range −55°C to +105°C with a rated endurance of 2000 hours at 105°C.
• Surface-Mount Package & Assembly — Chip-type radial can SMD (φ8 × 6.2 mm) designed for high-density PCBs and supplied in embossed carrier taping compatible with automatic mounting machines.
• Quality & Compliance — AEC-Q200 qualified and RoHS compliant for regulated and automotive system use.

Typical Applications

• Automotive electronics — Designed for use in automotive systems where AEC-Q200 qualification and a −55°C to +105°C operating range are required.
• High-density surface-mount power filtering — Compact chip form factor and low impedance make it suitable for decoupling and bulk capacitance on space-constrained PCBs.
• Automated assembly environments — Supplied in embossed carrier taping for reliable placement with automatic mounting machines.

Unique Advantages

• Compact high-capacitance SMD — 330 µF in a φ8 × 6.2 mm package reduces board area compared with larger can-style capacitors.
• Measured low impedance — 260 mΩ impedance and defined tan δ provide predictable AC performance for power rail smoothing.
• Broad ripple capability — Specified low- and high-frequency ripple ratings (150 mA at 120 Hz, 300 mA at 10 kHz) help manage both line-frequency and switching-noise currents.
• Automotive-grade reliability — AEC-Q200 qualification and 2000-hour endurance at 105°C support deployment in demanding environments.
• Production-ready packaging — Embossed carrier taping enables efficient pick-and-place integration in high-volume manufacturing.
• Regulatory compliance — RoHS compliant for use in regulated assemblies.

Why Choose UCD0J331MCL6GS?

The UCD0J331MCL6GS combines high capacitance with low impedance in a compact surface-mount radial-can package, delivering practical bulk and decoupling capacitance for designs constrained by board area and thermal requirements. Its AEC-Q200 qualification, broad temperature range (−55°C to +105°C) and 2000-hour endurance at 105°C position it for reliable use in automotive and other high-reliability systems.

Supplied for automated assembly in embossed carrier taping and engineered for predictable electrical characteristics (impedance, tan δ, leakage and ripple ratings), this capacitor supports scalable production and consistent field performance backed by Nichicon’s product specifications.

Request a quote or contact sales to check availability, lead time and to obtain order and packaging details for UCD0J331MCL6GS.