UCD0J332MNJ1MS

The UCD0J332MNJ1MS is a chip-type, low-impedance aluminum electrolytic capacitor from Nichicon's UCD series designed for surface mounting on high-density printed circuit boards. It delivers a high capacitance (3.3 mF) at a 6.3 V rating with polarized construction and is suitable for automated, tape-fed assembly.

Engineered for demanding temperature and endurance requirements, this capacitor is rated for operation from −55 °C to +105 °C, carries AEC‑Q200 qualification, and complies with RoHS (2011/65/EU, (EU)2015/863).

Key Features

• Electrical — High Capacitance: 3.3 mF (3300 μF) nominal capacitance with ±20% tolerance at 120 Hz, 20 °C, providing substantial charge storage for compact SMD designs.
• Electrical — Rated Voltage: 6.3 V rated voltage suitable for low-voltage power circuits.
• Low Impedance & Ripple Handling: Low-impedance chip construction with specified ripple current performance of 550 mA at 120 Hz and 1.1 A at 10 kHz.
• Thermal & Reliability: Operating temperature range −55 °C to +105 °C and endurance specified up to 5000 hours at 105 °C for long-term stability.
• Mechanical & Packaging: Chip-type, surface-mount can package (Radial, Can - SMD) with overall dimensions L: 1.35 × D: 1.25 cm and recommended land size L: 1.28 × W: 1.28 cm for high-density PCB layouts.
• Assembly Compatibility: Designed for surface mounting on high-density PC boards and applicable to automatic mounting machines fed with carrier tape for efficient production.
• Standards & Compliance: AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suited for electronic modules that require AEC‑Q200 qualification and wide temperature range operation up to +105 °C.
• High-Density PCB Assemblies — Designed for surface mounting where board space is constrained and compact SMD can-style capacitors are needed.
• Automated Manufacturing — Compatible with carrier-tape automatic mounting processes for high-volume assembly of SMD boards.

Unique Advantages

• AEC‑Q200 Qualified: Meets AEC‑Q200 qualification requirements for use in automotive-grade and other demanding electronic applications.
• High Capacitance in a Chip Package: 3.3 mF (3300 μF) nominal value provides bulk charge storage in a compact surface-mount can-style package.
• Low-Impedance Performance: Designed as a low-impedance chip type with specified ripple current capability (550 mA at 120 Hz, 1.1 A at 10 kHz) to support power conditioning on the board.
• Wide Temperature & Long Endurance: Rated from −55 °C to +105 °C with 5000 hours endurance at 105 °C, supporting long-term reliability under elevated temperature stress.
• Production-Friendly Packaging: Compatible with carrier-tape automated mounting machines and optimized land size for reliable SMD placement.
• Regulatory Compliance: RoHS compliant to applicable directives for environmental conformity.

Why Choose UCD0J332MNJ1MS?

The UCD0J332MNJ1MS combines high capacitance and low impedance in a compact, chip-type aluminum electrolytic package designed for surface-mount assembly. Its AEC‑Q200 qualification, extended temperature range to +105 °C, and specified endurance make it well suited to robust designs that require dependable bulk energy storage and ripple handling in constrained PCB spaces.

Choose this Nichicon UCD-series part when you need a production-friendly, high-capacitance SMD solution that aligns with automotive-grade qualification and RoHS compliance while delivering specified ripple and endurance characteristics for long-term stability.

Request a quote or contact sales to check availability and discuss pricing for UCD0J332MNJ1MS.