UCD0J470MCL1GS

The UCD0J470MCL1GS from Nichicon is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density PCBs. It delivers 47 µF capacitance at a 6.3 V rating with polarized construction and is qualified to AEC‑Q200 for automotive use.

Key value propositions include low impedance (700 mΩ), a wide operating temperature range to +105 °C, and ruggedness for automated assembly. Its compact SMD can size (5.8 mm × 5 mm) and tape‑feed compatibility support high‑volume manufacturing and dense board layouts.

Key Features

• Low Impedance — Rated impedance of 700 mΩ to support power decoupling and smoothing where reduced ESR matters.
• Rated Capacitance & Voltage — 47 µF nominal capacitance with a 6.3 V rated voltage and ±20% tolerance for predictable decoupling performance.
• Automotive Qualification — AEC‑Q200 rated construction for use in designs that require automotive‑grade component qualification.
• High Temperature Endurance — Specified for operation from −55 °C to +105 °C with a rated lifetime of 2000 hours at 105 °C.
• Ripple Current Handling — Supports 80 mA at 120 Hz and 160 mA at 10 kHz, suitable for both low‑ and high‑frequency ripple conditions.
• Surface‑Mount Package — Chip‑type radial can in an SMD footprint (L: 5.8 × D: 5 mm) with recommended land pattern L: 5.3 × W: 5.3 mm for automated placement.
• RoHS Compliant — Meets RoHS (2011/65/EU, (EU)2015/863) requirements for restricted substances.
• Polarized Design — Polarized electrolytic construction for bulk energy storage and power rail stabilization.

Typical Applications

• Automotive Electronics — Suitable for automotive systems that require AEC‑Q200 qualified capacitors and operation up to +105 °C for power smoothing and decoupling.
• High‑Density PCB Power Rails — Designed for surface mounting on compact PCBs where low impedance and a small SMD package aid tight power‑supply layouts.
• Automated Assembly Lines — Tape‑feed compatible chip form factor supports high‑volume pick‑and‑place manufacturing for commercial and automotive assemblies.

Unique Advantages

• Compact SMD Footprint: Small L: 5.8 × D: 5 mm package enables high‑density board designs without sacrificing capacitance.
• Designed for Automated Production: Carrier‑tape compatibility simplifies placement and reduces assembly cycle time in volume manufacturing.
• High‑Temperature Reliability: Rated to +105 °C with a defined lifetime (2000 h at 105 °C), supporting designs that face elevated operating temperatures.
• Frequency Versatility: Specified ripple current at both 120 Hz and 10 kHz accommodates a range of power‑supply ripple environments.
• Automotive‑Grade Qualification: AEC‑Q200 rating provides an explicit qualifier for applications that require automotive component standards.

Why Choose UCD0J470MCL1GS?

The UCD0J470MCL1GS combines a low‑impedance aluminum electrolytic construction with a compact SMD package and AEC‑Q200 qualification, making it well suited for engineers designing rugged, high‑density power systems. Its operating range to +105 °C, specified ripple current values, and tape‑feed form factor offer a balance of thermal endurance, electrical performance, and assembly efficiency.

This capacitor is a practical choice for designers and procurement teams targeting automotive or industrial applications that demand verified qualification, surface‑mount compatibility, and dependable decoupling performance in constrained spaces.

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