UCD0J470MCL6GS

The UCD0J470MCL6GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly on high-density PC boards. It provides 47 µF capacitance at a 6.3 V rated voltage with a compact φ4 × 5.8 mm can-style SMD package and embossed carrier taping for automated placement.

Engineered for demanding temperature and endurance requirements, this part supports operation from −55 °C to 105 °C, carries AEC-Q200 qualification, and is offered in mass-production packaging for high-volume manufacturing.

Key Features

• Capacitance and Voltage — 47 µF nominal capacitance with a 6.3 V rated voltage and ±20% tolerance (120 Hz, 20 °C).
• Low Impedance — Low-impedance chip design with an impedance value of 1.35 Ω, optimized for stable decoupling performance.
• Loss Characteristics — Tangent of loss angle (tan δ) specified at 0.26 (measured at 120 Hz, 20 °C).
• Ripple Current Capability — Rated ripple current of 45 mA at 120 Hz and 90 mA at 10 kHz to support AC stress in power circuits.
• Leakage and Reliability — Low leakage current specified at 3 µA, with endurance rated at 2000 hours at 105 °C.
• Robust Temperature Range — Operates from −55 °C to 105 °C for broad thermal tolerance in harsh environments.
• Surface-Mount Packaging — Can-style SMD (φ4 × 5.8 mm) with embossed carrier taping compatible with automatic placement equipment; surface-mount land size: 4.3 × 4.3 mm.
• Compliance — RoHS-compliant construction and AEC-Q200 qualification as noted in product information.

Typical Applications

• Automotive Electronics — Suited for automotive systems where AEC-Q200 qualification and operation to 105 °C are required.
• High-Density PCBs — Designed for surface mounting on compact, high-density printed circuit boards used in constrained spaces.
• Automated Assembly Lines — Supplied in embossed carrier taping for compatibility with automatic mounting machines and high-volume production.

Unique Advantages

• Compact, PCB-Friendly Footprint: The φ4 × 5.8 mm can-style SMD package and 4.3 × 4.3 mm recommended land provide a small form factor for space-constrained designs.
• Production-Ready Packaging: Embossed carrier taping enables automated placement, reducing manual handling and supporting high-volume assembly.
• Thermal Endurance: Rated for 2000 hours at 105 °C, supporting long-term operation under elevated temperature stress.
• Automotive-Grade Qualification: AEC-Q200 note in the product data signals suitability for automotive electronics that require component-level qualification.
• Low Leakage and Defined Loss: 3 µA leakage current and specified tan δ (0.26 at 120 Hz, 20 °C) help maintain predictable performance in DC and AC-biased circuits.
• Measured Ripple Performance: Explicit ripple current ratings at both low and high frequencies (45 mA at 120 Hz, 90 mA at 10 kHz) allow designers to select the part with known AC stress limits.

Why Choose UCD0J470MCL6GS?

UCD0J470MCL6GS combines a low-impedance, chip-type aluminum electrolytic construction with a compact SMD can package and carrier-taped supply for automated assembly. Its specified electrical characteristics—47 µF at 6.3 V, defined impedance and tan δ, low leakage, and rated ripple currents—make it a verifiable choice for engineers requiring predictable decoupling and filtering behavior in thermally demanding environments.

This part is positioned for designs that need AEC-Q200-qualified, RoHS-compliant components in mass-production workflows, offering a balance of compact size, endurance (2000 hours at 105 °C), and assembly-friendly packaging that supports robust, repeatable manufacturing.

For pricing, lead-time information, or to request a quotation for UCD0J470MCL6GS, please contact sales to submit your request and receive order support.