UCD0J221MCL1GS
| Part Description |
220 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,249 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 220 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.8 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 360 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 240 mA @ 10 kHz | Ripple Current Low Frequency | 120 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of UCD0J221MCL1GS – Aluminum Electrolytic Chip Capacitor, 220 µF, 6.3 V
The UCD0J221MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. With a 220 µF capacitance at 6.3 V rating and a compact φ6.3 × 5.8 mm package, it is intended for high-density PCB assemblies.
Targeted for automotive and industrial markets, this AEC-Q200 qualified device delivers temperature performance from −55°C to +105°C, combined with endurance and ripple capabilities suitable for demanding electronic power subsystems.
Key Features
- Capacitance & Voltage — 220 µF nominal capacitance with a 6.3 V rated voltage and ±20% tolerance, suitable for bulk decoupling in compact assemblies.
- Low Impedance Performance — Specified impedance of 360 mΩ and a tanδ (DF) of 0.26 measured at 20°C, 120 Hz, supporting effective smoothing and filtering in power rails.
- Ripple Current Handling — Low-frequency ripple current 120 mA (120 Hz) and high-frequency ripple current 240 mA (10 kHz), enabling reliable operation across a range of switching and AC conditions.
- Leakage & Reliability — Measured leakage current of 13.86 µA and endurance rated to 2000 hours at 105°C, providing predictable long-term behavior under elevated temperature stress.
- Wide Temperature Range — Operates from −55°C to +105°C, supporting designs exposed to broad ambient conditions.
- Compact Surface-Mount Package — Chip-type radial can SMD in φ6.3 × 5.8 mm footprint with recommended land size 6.6 × 6.6 mm; supplied on embossed carrier tape for automated placement.
- Standards & Compliance — RoHS compliant and AEC-Q200 qualified for automotive-grade use.
Typical Applications
- Automotive Electronics — Suited for surface-mount power modules and control units where AEC-Q200 qualification and temperature endurance are required.
- High-Density PCBs — Compact chip form factor designed for automatic placement on dense board layouts.
- Power Rail Decoupling — Provides bulk capacitance and ripple handling for DC-DC converters and local power filtering in embedded systems.
Unique Advantages
- AEC-Q200 Qualified: Provides documented automotive-grade qualification for use in regulated vehicle electronic systems.
- Compact Footprint: φ6.3 × 5.8 mm chip package minimizes board area while delivering 220 µF capacitance for space-constrained designs.
- Robust Thermal Endurance: 2000-hour rating at 105°C ensures predictable life performance in elevated temperature environments.
- Low Impedance and Stable Loss: 360 mΩ impedance and tanδ 0.26 (20°C, 120 Hz) support effective filtering and energy storage with controlled dissipation.
- High-Frequency Ripple Capability: 240 mA ripple at 10 kHz accommodates switching regulator and converter applications with significant HF content.
- Production-Ready Packaging: Embossed carrier taping enables efficient automated assembly and supply chain handling.
Why Choose UCD0J221MCL1GS?
UCD0J221MCL1GS is positioned for designers who need a compact, automotive-capable aluminum electrolytic solution that balances capacitance density, ripple handling, and thermal endurance. Its low-impedance chip format and AEC-Q200 qualification make it suitable for demanding vehicle and industrial power subsystems where board space and reliability matter.
Selecting this part offers predictable performance over a wide temperature range, standardized SMD packaging for automated assembly, and specification-level assurances for long-term use in regulated applications.
Request a quote or submit an inquiry to evaluate UCD0J221MCL1GS for your next design and obtain pricing, availability, and technical support information.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016