UCD0J152MNL1GS

The UCD0J152MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density PCBs. It combines high capacitance (1.5 mF / 1500 µF) with AEC‑Q200 qualification, a wide operating temperature range, and tape packaging for automated assembly.

Targeted at demanding applications including automotive electronics, this part delivers high ripple handling and long endurance for reliable power smoothing and decoupling in compact surface‑mount designs.

Key Features

• Core Type: Chip type, low impedance construction optimized for surface‑mount assembly and high‑density PCB layouts.
• Capacitance & Tolerance: 1.5 mF (1500 µF) with tolerance −20% to +20% at 120 Hz, 20°C.
• Rated Voltage & Loss: Rated at 6.3 V with tan δ = 0.26 measured at 20°C, 120 Hz.
• Ripple Current Capability: Low‑frequency ripple 425 mA (120 Hz) and high‑frequency ripple 850 mA (10 kHz) for effective filtering across bandwidths.
• Leakage Current: Specified leakage current of 94.5 µA after rated voltage application, supporting predictable bias behavior.
• Temperature & Endurance: Operating temperature range −55°C to +105°C with rated lifetime of 5000 hours at 105°C.
• Package & Mounting: Surface mount, chip/Can SMD package (φ10 × 10L / L: 1 cm × D: 1 cm) supplied in embossed carrier taping for automated placement.
• Compliance & Qualification: RoHS compliant and AEC‑Q200 rated for applications requiring recognized component qualification.

Typical Applications

• Automotive Electronics: Bulk decoupling and power smoothing in vehicle electronic modules where AEC‑Q200 qualification and high ripple capability are required.
• Power Supply Filtering: Local energy storage and ripple suppression on DC/DC converters and power rails that operate across −55°C to +105°C.
• High‑Density SMD Boards: Compact surface‑mount power networks and modules that benefit from chip‑type packaging and embossed carrier taping for automated assembly.

Unique Advantages

• High Capacitance in a Compact SMD Form: 1.5 mF in a φ10 × 10 mm package reduces board area compared with larger discrete solutions.
• Wide Temperature Endurance: Rated for −55°C to +105°C with a 5000‑hour life at 105°C, supporting long‑term stability in elevated ambient conditions.
• Strong Ripple Performance: Specified ripple current at both low (425 mA @ 120 Hz) and high (850 mA @ 10 kHz) frequencies enables effective filtering across control and switching domains.
• Automated Assembly Ready: Embossed carrier taping and SMD chip form factor streamline placement for high‑volume manufacturing.
• Qualified Reliability: AEC‑Q200 rating and RoHS compliance provide documented qualification and environmental compliance for regulated markets.

Why Choose UCD0J152MNL1GS?

UCD0J152MNL1GS positions itself as a compact, high‑capacitance SMD solution for designers needing reliable power decoupling and smoothing under wide temperature and endurance requirements. Its low impedance design, defined ripple current ratings, and AEC‑Q200 qualification make it suitable for production environments and regulated applications where traceable component performance matters.

This capacitor is well suited for engineers and procurement teams targeting automotive and other demanding electronic systems that require compact footprint, robust ripple handling, and long operational life backed by Nichicon’s product and datasheet specifications.

For pricing, lead times, or to request a quote for UCD0J152MNL1GS, please submit a request or contact the sales team to discuss your requirements and volume pricing.