UCD1A102MNS1GS

The UCD1A102MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It provides 1 mF capacitance at a 10 V rating in a compact radial can SMD package intended for automated carrier-tape assembly.

Engineered for applications that require elevated temperature endurance and qualification for demanding use, the part is RoHS compliant and AEC‑Q200 qualified with an operating temperature range from −55 °C to +105 °C and a rated lifetime specified at high temperature.

Key Features

• Capacitance & Voltage — 1 mF capacitance rated at 10 V provides bulk energy storage and decoupling capability for low-voltage power rails.
• Low-Impedance Chip Construction — Chip-type, low-impedance design specified for SMD use to support ripple handling and transient suppression on dense boards.
• Wide Temperature Range — Rated for −55 °C to +105 °C operation to support elevated-temperature environments.
• High-Temperature Endurance — Lifetime specified as 5,000 hours at 105 °C for long-term stability under thermal stress.
• Ripple Current Ratings — 425 mA at 120 Hz and 850 mA at 10 kHz, supporting both low- and high-frequency ripple management.
• Tolerance and Polarization — Capacitance tolerance of ±20% and polarized construction; designed for polarized DC applications.
• SMD Radial Can Package — Compact package dimensions (L: 1 × D: 1 cm) with recommended land size L: 1.03 × W: 1.03 cm and suitability for automatic mounting with carrier tape.
• Qualification & Environmental — AEC‑Q200 qualified and compliant to the RoHS directive (2011/65/EU, (EU)2015/863).
• Marking — Black print on the case top for clear identification.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and high-temperature endurance make the capacitor suitable for automotive power modules and control electronics requiring reliable bulk capacitance.
• Power Supply Decoupling — Low-impedance SMD construction and specified ripple current ratings support smoothing and decoupling on DC‑DC converters and local power rails.
• High-Density PCB Designs — Chip-type SMD format and carrier-tape compatibility enable automated placement on compact, densely populated boards.

Unique Advantages

• Qualified for Automotive Use: AEC‑Q200 qualification provides a documented reliability baseline for automotive and other high-reliability applications.
• High-Temperature Reliability: Rated to +105 °C with a 5,000-hour lifetime at that temperature, supporting long-term operation in thermal-stressed environments.
• Practical Ripple Handling: Specified ripple current values at 120 Hz and 10 kHz let designers size capacitors for both low- and high-frequency ripple suppression.
• SMD Ready for Automated Assembly: Chip-type radial can package and carrier-tape compatibility simplify automated surface-mount processes on high-density PCBs.
• Regulatory Compliance: RoHS compliance ensures conformity with applicable environmental directives.
• Compact Footprint: Small L × D package and defined land pattern allow efficient board layout and minimal PCB area for bulk capacitance.

Why Choose UCD1A102MNS1GS?

The UCD1A102MNS1GS delivers a balance of bulk capacitance, low impedance, and thermal endurance in an SMD-compatible chip form factor. Its 1 mF / 10 V rating, elevated operating temperature range, AEC‑Q200 qualification, and RoHS compliance make it suitable for designers building robust power delivery and decoupling networks on dense PCBs—particularly where automotive-grade reliability and long-term high-temperature endurance are required.

This part is targeted at engineers and procurement teams who need a compact electrolytic solution that supports automated assembly, offers measurable ripple current capability, and carries documented qualification for demanding applications.

If you would like pricing, lead-time information, or to request a quote for UCD1A102MNS1GS, please contact sales to submit your inquiry and request technical or purchasing support.