UCD0J681MNS1GS

CAP ALUM 680UF ±20% 6.3V SMD
Part Description

680 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,470 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCD
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance680 µFECCNEAR99
ESRN/AHeight Seated (Max)1.1 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp5000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency600 mA @ 10 kHzRipple Current Low Frequency300 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension10 x 8 mmSurface Mount Land Size8.3 x 8.3 mm
Tolerance-20%~20%Voltage6.3 V

Overview of UCD0J681MNS1GS – Chip-type low-impedance 680 µF, 6.3 V SMD capacitor

The UCD0J681MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a compact surface-mount can designed for high-density PCBs. It delivers 680 µF at 6.3 V with measured loss tangent (tanδ) of 0.26 (20°C, 120 Hz), making it suitable where bulk capacitance and low impedance density are required.

Engineered for robust environments, this part supports a wide operating temperature range from -55°C to 105°C, a 5000-hour endurance at 105°C, AEC-Q200 qualification, and embossed carrier taping for automated placement—attributes that target demanding automotive and industrial assembly processes.

Key Features

  • Electrical Performance — 680 µF capacitance rated at 6.3 V with a capacitance tolerance of -20% to +20% and a tanδ (DF) of 0.26 measured at 20°C, 120 Hz, supporting stable bulk capacitance in low-voltage systems.
  • Ripple Handling — Low-frequency ripple current 300 mA (120 Hz) and high-frequency ripple current 600 mA (10 kHz) for improved smoothing and transient support in power rails.
  • Reliability & Endurance — Long-life endurance of 5000 hours at 105°C and AEC-Q200 qualification for applications requiring higher reliability and extended thermal stress performance.
  • Wide Temperature Range — Operates from -55°C to 105°C for use across broad environmental conditions.
  • Compact SMD Package — Chip-type radial can for surface mount (φ8 × 10L, size L: 1 × D: 0.8 cm) with recommended land size 8.3 × 8.3 mm, optimized for high-density board layouts.
  • Assembly-Friendly Packaging — Supplied in embossed carrier taping compatible with automatic mounting machines; vibration resistant for robust assembly and in-field durability.
  • Low Leakage — Specified leakage current of 42.84 µA, enabling predictable standby and bias performance after application of rated voltage.

Typical Applications

  • Automotive electronic systems — AEC-Q200-qualified component suitable for automotive modules that require bulk capacitance and wide-temperature endurance.
  • Power management and decoupling — Compact, low-impedance 680 µF capacitance with defined LF and HF ripple ratings for smoothing and local energy buffering on low-voltage rails.
  • High-density surface-mount assemblies — Chip-type can and embossed carrier taping enable automated placement on compact PCBs where space and assembly throughput are priorities.

Unique Advantages

  • AEC-Q200 qualification — Provides an established baseline for automotive-grade reliability where that qualification is required.
  • High-temperature endurance — 5000 hours at 105°C supports long-term operation under elevated thermal stress, reducing need for frequent redesigns.
  • Broad operating range — −55°C to 105°C supports use across harsh ambient conditions and temperature cycling.
  • Balanced ripple capability — Defined low- and high-frequency ripple currents (300 mA @120 Hz, 600 mA @10 kHz) let designers quantify margin for both mains-frequency and switching-frequency noise.
  • Automated assembly ready — Embossed carrier taping and surface-mount form factor simplify pick-and-place integration and support higher PCB assembly throughput.
  • Predictable leakage and loss — Specified leakage current (42.84 µA) and tanδ provide measurable parameters for budgeting power loss and standby drain.

Why Choose UCD0J681MNS1GS?

UCD0J681MNS1GS combines the UCD series' chip-type, low-impedance design with automotive-oriented qualification and long-duration endurance, delivering a compact surface-mount solution for applications that demand reliable bulk capacitance in challenging thermal environments. Its defined ripple ratings, controlled loss tangent, and low leakage current make it straightforward to engineer into power delivery and filtering networks.

This part is well suited to designers and procurement teams specifying components for automotive or other mission-critical electronics that require AEC-Q200 qualification, long-term high-temperature performance, and automated assembly compatibility from a recognized manufacturer, Nichicon.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for UCD0J681MNS1GS.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


    Employees: 5,000+


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