UCD0J681MCL6GS

The UCD0J681MCL6GS is a chip‑type aluminum electrolytic capacitor engineered for surface‑mount, high‑density PCB applications. It delivers 680 µF of capacitance at a rated voltage of 6.3 V in a compact φ10 × 7.7 mm can‑style SMD package.

Designed for low impedance operation across a wide temperature range (‑55 °C to 105 °C), this part is AEC‑Q200 qualified and supplied in embossed carrier taping for automated assembly, making it suitable for demanding automotive and industrial power‑rail applications requiring stable bulk capacitance and ripple handling.

Key Features

• Capacitance & Voltage — 680 µF nominal capacitance with a rated voltage of 6.3 V and a tolerance of ±20% (‑20% to +20%).
• Low Impedance Performance — Rated impedance of 180 mΩ and a loss tangent (tanδ) of 0.26 at 6.3 V, 120 Hz, 20 °C for reduced voltage drop and improved ripple suppression.
• Ripple Current Handling — Low‑frequency ripple current of 300 mA (120 Hz) and high‑frequency ripple current of 600 mA (10 kHz), supporting converter and regulator output filtering.
• Leakage & Polarization — Polarized aluminum electrolytic construction with measured leakage current of 42.84 µA.
• Temperature & Endurance — Rated for operation from ‑55 °C to 105 °C with an endurance life of 2000 hours at 105 °C.
• Package & Assembly — Chip type can (radial, SMD) size φ10 × 7.7L mm, surface‑mountable with embossed carrier taping for automated pick‑and‑place.
• Qualification & Compliance — AEC‑Q200 qualified and RoHS compliant for regulated environments and automotive applications.

Typical Applications

• Automotive power electronics — Bulk decoupling and smoothing on vehicle power rails where AEC‑Q200 qualification and high temperature endurance are required.
• DC‑DC converter output filtering — Low impedance and high ripple current capability make it suitable for stabilizing converter outputs on compact SMD boards.
• High‑density PCB designs — Chip type can and embossed carrier taping enable automated assembly and space‑efficient placement on dense layouts.

Unique Advantages

• High bulk capacitance in a compact SMD can — 680 µF in a φ10 × 7.7 mm package provides substantial energy storage without large board area.
• Low impedance for improved ripple control — 180 mΩ impedance and 0.26 tanδ at rated conditions help reduce voltage ripple and improve regulator stability.
• Rated for elevated temperatures — Endurance of 2000 hours at 105 °C supports prolonged operation in hot environments.
• Designed for automated assembly — Embossed carrier taping and chip‑type form factor simplify pick‑and‑place for high‑volume production.
• AEC‑Q200 Qualified and RoHS Compliant — Provides qualification and regulatory compliance required for automotive and regulated applications.
• Measurable leakage and ripple specs — Published leakage current (42.84 µA) and frequency‑dependent ripple ratings allow predictable performance planning.

Why Choose UCD0J681MCL6GS?

UCD0J681MCL6GS is positioned for designs that require substantial bulk capacitance, low impedance, and reliable operation at elevated temperatures in a surface‑mount form factor. Its combination of 680 µF capacitance, 6.3 V rating, defined ripple current capability, and AEC‑Q200 qualification makes it a practical choice for engineers building robust power rails in automotive and industrial systems.

By offering embossed carrier taping for automated assembly, defined endurance at 105 °C, and RoHS compliance, this capacitor supports production scalability and long‑term in‑field reliability while fitting compact, high‑density PCB layouts.

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