UCD0J680MCL1GS

The UCD0J680MCL1GS from Nichicon is a chip-type, low-impedance aluminum electrolytic capacitor engineered for surface-mount assembly on high-density printed circuit boards. It delivers 68 µF at 6.3 V in a compact φ6.3 × 5.8 mm SMD can and is supplied in embossed carrier taping for automated placement.

Designed for demanding thermal environments, this part operates from −55 °C to 105 °C, carries AEC-Q200 ratings for automotive use, and is offered as a RoHS-compliant, mass-production component suitable for applications requiring compact, reliable DC filtering and energy smoothing on SMD assemblies.

Key Features

• Capacitance & Voltage — 68 µF nominal capacitance with a rated voltage of 6.3 V and tolerance of −20% to +20%.
• Low Impedance Performance — Specified impedance of 360 mΩ and a tangent of loss angle (tan δ) of 0.26 measured at 20 °C, 120 Hz, providing stable AC behavior for decoupling and smoothing in compact layouts.
• Ripple Current Ratings — Low-frequency ripple current of 120 mA (120 Hz) and high-frequency ripple current of 240 mA (10 kHz) to support transient and AC ripple handling in power circuits.
• Leakage and Endurance — Measured leakage current of 4.284 µA and endurance rating of 2000 hours at 105 °C, supporting long-term operation at elevated temperatures.
• Compact SMD Package — Chip-type radial can SMD, size φ6.3 × 5.8 mm with surface mount land size L: 6.6 × W: 6.6 mm, optimized for high-density board designs.
• Assembly & Compliance — Supplied in embossed carrier taping for automatic mounting machines and compliant with RoHS. AEC-Q200 qualification is listed for automotive suitability.

Typical Applications

• Automotive Electronics — AEC-Q200-qualified chip-type SMD capacitor for use on automotive PCBs where compact filtering and temperature resilience (−55 °C to 105 °C) are required.
• High‑Density SMD Assemblies — Intended for surface mounting on high-density printed circuit boards and compatible with automated placement using embossed carrier taping.
• Power Supply Filtering — Suited to on-board power smoothing and AC ripple mitigation in compact power modules, leveraging low impedance and specified ripple current ratings.

Unique Advantages

• Compact footprint: φ6.3 × 5.8 mm chip can delivers 68 µF in a small SMD package to save board space in dense designs.
• Low-impedance behavior: 360 mΩ impedance and defined tan δ support effective decoupling and stable AC performance at 120 Hz measurements.
• Automated assembly ready: Embossed carrier taping enables reliable feeding for pick-and-place equipment, simplifying high-volume production.
• Wide temperature range: Rated for −55 °C to 105 °C with 2000 hours endurance at 105 °C for sustained performance in elevated-temperature environments.
• Automotive-grade qualification: AEC-Q200 rating provides documented qualification for automotive system use where that certification is required.
• Regulatory compliance: RoHS-compliant construction supports environmental and regulatory requirements for modern electronics manufacturing.

Why Choose UCD0J680MCL1GS?

The UCD0J680MCL1GS combines a compact chip-type SMD form factor with low impedance characteristics, defined ripple current capability, and automotive-oriented qualification to meet the needs of space-constrained, high-reliability designs. Its embossed carrier taping and surface-mount compatibility streamline automated assembly while the −55 °C to 105 °C operating range and 2000-hour endurance at 105 °C provide thermal robustness for demanding environments.

This part is well suited for engineers specifying capacitors for automotive electronics and other applications that require a small, AEC‑Q200-qualified aluminum electrolytic with verifiable performance metrics and production-ready packaging.

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