UCD1A101MCL1GS

The UCD1A101MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density PCBs. It provides 100 µF capacitance at a 10 V rating in a compact φ6.3 × 5.8 mm package optimized for automated assembly.

Built for demanding operating environments, this AEC‑Q200 qualified part supports automotive applications with an operating temperature range of −55 °C to +105 °C and a rated endurance of 2000 hours at 105 °C, delivering reliable filtering and decoupling where space and thermal performance matter.

Key Features

• Core Type Chip‑type aluminum electrolytic capacitor optimized for surface‑mount use on high‑density PC boards and automatic mounting with embossed carrier taping.
• Capacitance & Voltage 100 µF nominal capacitance with tolerance −20% to +20% at 120 Hz, 20 °C; rated voltage 10 V.
• Electrical Performance Low impedance design with specified impedance of 360 mOhm and tangent of loss angle (tanδ) 0.19 measured at 20 °C, 120 Hz.
• Ripple Current & Leakage Low frequency ripple current: 120 mA (120 Hz); high frequency ripple current: 240 mA (10 kHz). Leakage current specified at 10 µA.
• Thermal & Lifetime Operating temperature range −55 °C to +105 °C; endurance rating of 2000 hours at 105 °C.
• Package & Mounting Compact dimensions φ6.3 × 5.8 mm (L: 5.8 × D: 6.3 mm) with recommended land size 6.6 × 6.6 mm; supplied in embossed carrier taping for automated pick‑and‑place.
• Quality & Compliance AEC‑Q200 qualified and RoHS compliant.

Typical Applications

• Automotive electronics Suitable for automotive modules where AEC‑Q200 qualification and high temperature endurance are required.
• Surface‑mount power filtering on high‑density PCBs Compact chip form factor and low impedance support decoupling and smoothing in space‑constrained board designs.
• High‑volume automated assembly Supplied in embossed carrier taping, enabling pick‑and‑place compatibility for efficient production.

Unique Advantages

• Low‑impedance performance: Impedance of 360 mOhm and low tanδ (0.19 at 120 Hz, 20 °C) help reduce voltage ripple and improve transient response on power rails.
• Automotive‑grade reliability: AEC‑Q200 qualification and 2000‑hour endurance at 105 °C provide confidence for temperature‑stressed applications.
• Compact SMD footprint: φ6.3 × 5.8 mm package and defined land pattern enable high‑density PCB layouts without sacrificing capacitance.
• Manufacturing ready: Embossed carrier taping supports automatic mounting, simplifying integration into automated production lines.
• Controlled leakage and ripple handling: Specified leakage current (10 µA) and separate low‑ and high‑frequency ripple current ratings support mixed frequency filtering needs.

Why Choose UCD1A101MCL1GS?

The UCD1A101MCL1GS delivers a balanced combination of capacitance, low impedance, thermal endurance and compact SMD packaging for designers needing reliable power decoupling in confined spaces. Its AEC‑Q200 qualification and 2000‑hour life at 105 °C make it suitable for demanding environments where automotive‑grade reliability and RoHS compliance are required.

This part is well suited to engineers specifying components for high‑density boards, automated assembly, and systems that require stable electrical performance across −55 °C to +105 °C. The component’s measured characteristics and standardized packaging support predictable integration and production scalability.

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