UCD1J681MNJ1MS

The UCD1J681MNJ1MS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly. It delivers 680 µF capacitance at a 63 V rating in a compact φ18 × 16.5 mm can suitable for automatic mounting on high-density PCBs.

Key value comes from its combination of low loss (tanδ 0.08 at 120 Hz, 20°C), high ripple capability (845 mA at 120 Hz / 1.69 A at 10 kHz), extended endurance (5000 hours at 105°C), and AEC-Q200 qualification for automotive applications.

Key Features

• Capacitance & Voltage — 680 µF nominal capacitance with a rated voltage of 63 V and capacitance tolerance of −20% to +20% (120 Hz, 20°C).
• Low Impedance / Low Loss — Tangent of loss angle (tanδ) specified at 0.08 (measured at 120 Hz, 20°C) for reduced power loss in smoothing and decoupling applications.
• Ripple Current Performance — Low-frequency ripple current 845 mA at 120 Hz and high-frequency ripple current 1.69 A at 10 kHz, supporting dynamic filtering and power regulation tasks.
• Endurance & Temperature Range — Rated for operation from −55°C to +105°C with a specified life of 5000 hours at 105°C.
• Leakage Current — Specified leakage current of 428.4 µA (measured after voltage application conditions in the product data).
• Surface-Mount Packaging — Chip-type radial can in an SMD package (φ18 × 16.5L) supplied in embossed carrier taping for automatic placement.
• AEC-Q200 Qualified & RoHS Compliant — Rated for automotive-grade reliability and compliant with RoHS directive.
• Polarized — Polar capacitor construction for correct orientation in DC circuits.
• Board Footprint — Recommended surface mount land size L: 1.83 × W: 1.83 cm to match the package dimensions (L: 1.65 × D: 1.8 cm).

Typical Applications

• Automotive Electronics — Suitable for automotive electronic modules where AEC-Q200 qualification and high-temperature endurance are required.
• Surface-Mount High-Density PCBs — Designed for placement on compact, high-density boards with compatibility for automatic mounting from carrier tape.
• Power Filtering and Decoupling Assemblies — Used where high capacitance, elevated ripple capability, and low impedance are needed to stabilize DC rails.

Unique Advantages

• High Capacitance in an SMD Can: 680 µF at 63 V provides substantial energy storage for smoothing and decoupling without a through-hole footprint.
• Low Loss for Efficient Operation: tanδ of 0.08 (120 Hz, 20°C) reduces dissipation in AC ripple conditions, improving thermal performance.
• Robust Ripple Handling: Specified ripple currents of 845 mA (120 Hz) and 1.69 A (10 kHz) address both low- and high-frequency ripple environments.
• Extended High-Temperature Life: 5000 hours at 105°C supports long-term reliability in elevated-temperature applications.
• Automated Assembly Ready: Supplied in embossed carrier taping and designed for surface mounting to streamline pick-and-place production.
• Automotive-Grade Qualification: AEC-Q200 rating provides traceable suitability for automotive electronic designs.

Why Choose UCD1J681MNJ1MS?

The UCD1J681MNJ1MS combines high capacitance and low impedance in a chip-type SMD can optimized for automated manufacturing and high-density PCB layouts. Its specification set — 63 V rating, low tanδ, robust ripple current capability, RoHS compliance, and AEC-Q200 qualification — positions it for applications that demand endurance and predictable electrical performance at elevated temperatures.

This part is suited for designers and procurement teams building automotive and industrial power systems that require reliable bulk capacitance, thermal resilience, and compatibility with surface-mount assembly processes.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for UCD1J681MNJ1MS.