UCD1J680MNL1GS

The UCD1J680MNL1GS is a surface-mount aluminum electrolytic capacitor in Nichicon’s UCD series, offering a chip-type, low-impedance design for high-density PCB assemblies. It is specified at 68 µF with a 63 V rating and a wide operating temperature range from −55°C to 105°C.

This part targets applications requiring AEC-Q200 qualification, RoHS compliance, and robust endurance (2000 hours at 105°C). It is supplied in embossed carrier tape for automated placement and designed for compact SMD can installation (φ10 × 10L footprint).

Key Features

• Capacitance & Voltage — Rated capacitance 68 µF with a rated voltage of 63 V and tolerance of −20% to +20%.
• Low Impedance Performance — Chip-type, low-impedance construction with a measured tanδ of 0.08 (120 Hz, 20°C) to support stable AC behavior.
• Ripple and Leakage — Low-frequency ripple current 200 mA (120 Hz) and high-frequency ripple current 400 mA (10 kHz); specified leakage current 42.84 µA.
• Thermal and Endurance — Rated for operation from −55°C to 105°C with endurance specified as 2000 hours at 105°C for 63 V parts.
• Package & Mounting — SMD radial can package (φ10 × 10L) with embossed carrier taping compatible with automatic mounting machines; recommended surface mount land size 1.03 × 1.03 cm.
• Industry Qualification and Compliance — AEC-Q200 qualified and compliant with RoHS directives.

Typical Applications

• Automotive Electronics — Designed for automotive modules where AEC-Q200 qualification and a wide temperature range (−55°C to 105°C) are required.
• High-Density PCB Assemblies — Chip-type SMD can and embossed carrier tape support automated placement on compact, densely routed boards.
• Power Modules and DC–DC Converters — 63 V rating together with specified low- and high-frequency ripple current capability addresses energy storage and smoothing needs on power rails.

Unique Advantages

• Compact SMD Can Format — φ10 × 10L package provides a small footprint for space-constrained board designs while maintaining can-style reliability.
• Low-impedance Design — Tanδ of 0.08 at 120 Hz (20°C) indicates controlled dissipation for applications sensitive to AC loss.
• Broad Temperature Range — Rated operation from −55°C to 105°C supports deployment across demanding thermal environments.
• Automated Assembly Ready — Embossed carrier taping and SMD compatibility simplify high-volume placement and production workflows.
• AEC-Q200 Qualification — Explicit industry qualification for designs that require automotive-grade component selection.

Why Choose UCD1J680MNL1GS?

UCD1J680MNL1GS combines a compact chip-type SMD can with low-impedance performance and robust thermal endurance, making it suitable for engineers specifying capacitors for demanding electronic modules. Its 63 V rating, defined ripple current performance at both low and high frequencies, and AEC-Q200 qualification position it for use in automotive and other harsh-environment designs where verified endurance and compliance matter.

For teams designing dense PCBs and automated manufacturing flows, this Nichicon UCD series part delivers a vetted SMD aluminum electrolytic solution with clear, verifiable electrical and thermal specifications.

If you would like pricing or availability, request a quote or contact sales to submit your requirements and receive a formal quote for UCD1J680MNL1GS.