UCD1J471MNJ1MS

The UCD1J471MNJ1MS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. It delivers 470 µF capacitance at a 63 V rating with a wide operating temperature range from -55 °C to 105 °C and a documented endurance of 5000 hours at 105 °C.

Engineered for automated assembly, embossed carrier taping accommodates pick‑and‑place processes while the AEC‑Q200 qualification and RoHS compliance support demanding, regulated designs that require long life and robust performance.

Key Features

• Capacitance & Voltage — 470 µF nominal capacitance with a rated voltage of 63 V and a capacitance tolerance of ±20% (measured at 120 Hz, 20 °C).
• Low Impedance & Loss — Low impedance chip construction with a tangent of loss angle (tan δ) of 0.08 measured at 20 °C and 120 Hz for stable AC performance.
• Ripple Current Capability — Supports low‑frequency ripple current of 705 mA at 120 Hz and high‑frequency ripple current of 1.41 A at 10 kHz, enabling effective smoothing in power circuits.
• Leakage Current — Measured leakage current of 296.1 µA, suitable for applications where controlled leakage characteristics are required.
• Robust Endurance — Rated for 5000 hours at 105 °C, offering long operational life under elevated temperature stress.
• Package & Mounting — Chip‑type radial can in an SMD form factor (φ16 × 16.5L) with embossed carrier taping for automatic surface‑mount assembly.
• Compliance & Qualification — AEC‑Q200 qualified and RoHS compliant, supporting regulated and reliability‑sensitive designs.

Typical Applications

• Automotive Electronic Systems — AEC‑Q200 qualification combined with a -55 °C to 105 °C operating range and 5000‑hour endurance at 105 °C makes this capacitor suitable for automotive electronics requiring long‑term stability.
• High‑Density Surface‑Mount Power Modules — Chip type and embossed carrier taping are optimized for surface mounting on compact, high‑density PCBs where automatic placement is used.
• Power Filtering and Smoothing — High capacitance (470 µF) and rated ripple currents at both low and high frequencies support bulk filtering and smoothing in DC power rails.

Unique Advantages

• High Capacitance in SMD Form — 470 µF in a φ16 × 16.5L chip package provides substantial bulk capacitance while preserving board area for dense designs.
• Designed for Automated Assembly — Embossed carrier taping enables compatibility with pick‑and‑place equipment and streamlines high‑volume production.
• Wide Temperature Range and Long Life — -55 °C to 105 °C operation with 5000 hours endurance at 105 °C offers predictable performance in elevated‑temperature environments.
• Dual‑Mode Ripple Handling — Specified ripple current at 120 Hz (705 mA) and at 10 kHz (1.41 A) supports both low‑ and high‑frequency decoupling requirements.
• Qualification and Compliance — AEC‑Q200 qualification and RoHS compliance support regulated design requirements and environmental directives.
• Controlled Dielectric Loss — tan δ of 0.08 (120 Hz, 20 °C) indicates predictable AC loss behavior for power and decoupling applications.

Why Choose UCD1J471MNJ1MS?

The UCD1J471MNJ1MS balances high capacitance, low impedance, and robust thermal endurance in a surface‑mount chip package tailored for automated assembly. Its combination of 470 µF at 63 V, measured ripple current capabilities, and AEC‑Q200 qualification positions it as a practical choice for engineers designing long‑life power subsystems and compact, high‑density assemblies.

This capacitor is well suited for designers who require verifiable endurance data, controlled leakage and loss characteristics, and packaging that supports high‑volume manufacturing. RoHS compliance and embossed carrier taping further streamline integration into regulated, production environments.

For pricing, availability, or to request a quote for UCD1J471MNJ1MS, please submit a quote request or contact sales through your preferred procurement channel.