UCD1J330MNL1GS

CAP ALUM 33UF ±20% 63V SMD
Part Description

33 µF 63 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,121 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCD
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance33 µFECCNEAR99
ESRN/AHeight Seated (Max)1.1 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency250 mA @ 10 kHzRipple Current Low Frequency125 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension10 x 8 mmSurface Mount Land Size8.3 x 8.3 mm
Tolerance-20%~20%Voltage63 V

Overview of UCD1J330MNL1GS – 33 µF, 63 V Surface-Mount Aluminum Electrolytic Capacitor

The UCD1J330MNL1GS is a surface-mount aluminum electrolytic capacitor from Nichicon’s UCD series, designed as a chip-type, low-impedance SMD solution. It delivers 33 µF capacitance at a 63 V rating with AEC-Q200 qualification and RoHS compliance, targeting automotive and other demanding electronics that require a compact, high-voltage, temperature-tolerant capacitor.

Key Features

  • Electrical Performance 33 µF nominal capacitance with tolerance ±20% (measured at 120 Hz, 20°C). Rated voltage is 63 V with a tangent of loss angle (tan δ) of 0.08 at 120 Hz, 20°C.
  • Ripple Handling Low-frequency ripple current of 125 mA at 120 Hz and high-frequency ripple current of 250 mA at 10 kHz, enabling effective smoothing and decoupling across frequency ranges.
  • Leakage Current Specified leakage current of 20.79 µA under rated conditions, suitable for applications with moderate leakage constraints.
  • Temperature and Endurance Rated for operation from −55°C to +105°C with an endurance rating of 2000 hours at 105°C (per product endurance conditions).
  • Package and Mounting Chip-type radial can for SMD with size φ8 × 10 L (approx. 8 mm diameter × 10 mm length). Supplied in embossed carrier taping for automated placement.
  • Automotive Qualification & Compliance AEC-Q200 qualified and RoHS compliant, aligning the part with regulated industry requirements.

Typical Applications

  • Automotive electronic modules Suited for on-board electronics that require AEC-Q200 qualified capacitors rated to 63 V and operating up to 105°C.
  • Power supply decoupling Used where 33 µF bulk decoupling and ripple suppression are required across low and high frequency components.
  • Surface-mount designs for high-density PCBs Chip-type SMD footprint and embossed carrier taping support automated assembly on compact, high-density boards.

Unique Advantages

  • High-voltage, compact SMD form: Provides 63 V rating in a φ8 × 10 mm SMD package for space-constrained designs.
  • Frequency-flexible ripple performance: Specified ripple currents at both 120 Hz and 10 kHz help address smoothing across a wide frequency range.
  • Wide operating temperature range: −55°C to +105°C operation and 2000-hour endurance at 105°C support reliability in thermally demanding environments.
  • Automotive-grade qualification: AEC-Q200 qualification and RoHS compliance provide traceable suitability for regulated automotive electronics.
  • Assembly-ready packaging: Embossed carrier taping enables automated pick-and-place for high-volume manufacturing.

Why Choose UCD1J330MNL1GS?

The UCD1J330MNL1GS combines a compact chip-type SMD package with a 63 V rating and low-impedance characteristics, making it a practical choice for designers who need robust decoupling and bulk capacitance in constrained spaces. Its AEC-Q200 qualification, broad temperature range, and defined ripple/ leakage specifications position it for automotive and industrial electronics requiring documented endurance and performance.

This part is well suited to teams specifying components for high-density PCBs and automated assembly, providing predictable electrical behavior and supply-chain readiness through embossed carrier taping and mass-production status.

Request a quote or submit your design requirements to receive pricing and lead-time information for the UCD1J330MNL1GS. Provide part number, quantity, and any delivery or qualification needs to get a tailored response.

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