UCD1J330MNS1GS
| Part Description |
33 µF 63 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 809 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 33 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.1 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 250 mA @ 10 kHz | Ripple Current Low Frequency | 125 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 63 V |
Overview of UCD1J330MNS1GS – Chip Type Low-Impedance Aluminum Electrolytic Capacitor, 33 µF · 63 V · SMD
The UCD1J330MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. It delivers 33 µF capacitance at a 63 V rating with a wide operating temperature range of -55 °C to 105 °C, making it suitable for compact power-decoupling and filtering functions on high-density PCBs.
Built for automated assembly (embossed carrier taping) and AEC-Q200 qualification, this component targets demanding electronics applications where temperature endurance, controlled loss (tanδ) and measurable ripple handling are required.
Key Features
- Low-Impedance Chip Type Chip-style construction optimized for surface-mount placement to support compact, high-density PCB layouts.
- Electrical Performance 33 µF nominal capacitance with tolerance of -20% to +20% and a tangent of loss angle (tanδ) of 0.08 measured at 20 °C, 120 Hz (rated 63 V), supporting stable AC behavior in filtering applications.
- Voltage Rating Rated for 63 V operation, suitable for mid-voltage power rails and decoupling duties within that voltage envelope.
- Ripple Current Capability Low-frequency ripple current 125 mA (120 Hz) and high-frequency ripple current 250 mA (10 kHz), enabling effective smoothing of both low- and high-frequency disturbances.
- Leakage and Endurance Specified leakage current of 20.79 µA and endurance of 2000 hours at 105 °C, providing predictable behavior over life testing conditions.
- Robust Thermal and Mechanical Range Operating temperature -55 °C to 105 °C and vibration-resistant construction for reliable performance across thermally and mechanically challenging environments.
- Surface-Mount Package Radial can SMD package (φ8 × 10L, L: 1.0 cm × D: 0.8 cm) with recommended land pattern 8.3 × 8.3 mm; supplied in embossed carrier taping for automated pick-and-place.
- Quality and Compliance AEC-Q200 qualified and RoHS compliant, supporting use in regulated production environments that require component-level qualification.
Typical Applications
- Automotive Electronics Filtering and decoupling on control modules and power management boards where AEC-Q200 qualification and operation to 105 °C are required.
- Power Supply Filtering Bulk and smoothing capacitor for intermediate rails and DC–DC converter outputs in compact SMD assemblies.
- Industrial Control Decoupling and ripple suppression in controller boards and sensor interfaces exposed to wide temperature swings and vibration.
Unique Advantages
- Reliable High-Temperature Endurance 2000-hour rated life at 105 °C provides predictable long-term behavior in elevated-temperature environments.
- Measurable Low-Loss Performance Specified tanδ of 0.08 at 120 Hz (20 °C) for the 63 V version enables designers to account for dielectric losses in thermal and AC analyses.
- Dual-Frequency Ripple Handling Separate ripple current specifications for 120 Hz and 10 kHz allow clear selection for both low- and high-frequency noise mitigation.
- Automated Assembly Ready Embossed carrier taping and SMD form factor streamline placement and throughput in volume surface-mount production.
- Industry-Grade Qualification AEC-Q200 qualification and RoHS compliance support use in regulated designs that require documented component qualification.
Why Choose UCD1J330MNS1GS?
UCD1J330MNS1GS balances low-impedance, controlled loss characteristics and a compact SMD can package to meet the needs of engineers designing mid-voltage power rails and decoupling networks. Its defined ripple current ratings, measured tanδ, leakage current spec and 2000-hour endurance at 105 °C provide verifiable parameters for thermal, reliability and performance planning.
This part is suited to teams developing automotive-grade and industrial electronics that require AEC-Q200 qualification, automated assembly compatibility and predictable behavior across -55 °C to 105 °C operating conditions.
Request a quote or contact sales to discuss availability, lead times and pricing for UCD1J330MNS1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016