UCD1J221MNQ1MS

The UCD1J221MNQ1MS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount assembly on high‑density PC boards. It provides 220 µF capacitance at a 63 V rating in a compact φ12.5 × 13.5 mm can, optimized for applications requiring stable filtering and energy storage across a wide temperature range.

Key value comes from its low loss (tanδ 0.08 at 20°C, 120 Hz), elevated temperature capability (‑55°C to 105°C), and long endurance (5000 hours at 105°C), backed by AEC‑Q200 qualification and RoHS compliance.

Key Features

• Capacitance & Voltage: 220 µF nominal with tolerance ±20% and a rated voltage of 63 V, suitable for mid‑voltage power rail applications.
• Low Impedance / Low Loss: tanδ (DF) 0.08 measured at 20°C, 120 Hz, delivering low ESR behavior for improved ripple handling and stable performance.
• Ripple Current Performance: Low‑frequency ripple current 400 mA (120 Hz) and high‑frequency ripple current 800 mA (10 kHz), supporting dynamic power demands.
• Thermal & Endurance: Operating temperature range of ‑55°C to 105°C with rated endurance of 5000 hours at 105°C for extended high‑temperature operation.
• Leakage Current: Specified leakage current of 138.6 µA, measured after rated voltage application at 20°C.
• Package & Mounting: Chip type radial can (SMD) sized φ12.5 × 13.5L, surface mount with embossed carrier taping for automated placement.
• Reliability & Compliance: AEC‑Q200 qualified and RoHS compliant for use in regulated and demanding environments.

Typical Applications

• Automotive Power Systems: Energy storage and smoothing on power rails where AEC‑Q200 qualification and high‑temperature endurance are required.
• DC–DC Converters and Voltage Regulation: Output filtering and decoupling for converter stages that require 63 V dielectric strength and high ripple capability.
• High‑Density Surface‑Mount Designs: PCB power distribution in compact assemblies where chip‑type SMD packaging and embossed carrier taping support automated placement.

Unique Advantages

• High‑temperature endurance: 5000 hours at 105°C enables sustained operation in elevated‑temperature environments without rapid degradation.
• Low loss, improved ripple handling: tanδ 0.08 and specified ripple currents (400 mA @120 Hz, 800 mA @10 kHz) help maintain stable voltage rails under dynamic loads.
• AEC‑Q200 qualification: Built to a recognized stress‑test standard, supporting deployment in demanding and regulated automotive applications.
• SMD chip form factor with tape packaging: Compact φ12.5 × 13.5 mm can and embossed carrier taping simplify automated assembly for high‑density boards.
• Regulatory compliance: RoHS compliant for environmental conformity in production and fielded products.

Why Choose UCD1J221MNQ1MS?

The UCD1J221MNQ1MS combines a robust 63 V dielectric, low loss characteristics, and elevated temperature endurance in a surface‑mount chip package. Its specification set — including low tanδ, defined ripple current ratings, and AEC‑Q200 qualification — makes it suitable for engineers designing reliable power delivery and filtering solutions for automotive and other demanding applications.

This part is well suited to designs that prioritize thermal stability, long operating life at high temperatures, and automated assembly readiness, delivering measurable reliability and predictable electrical behavior across the specified operating range.

Request a quote or contact our sales team to discuss availability, lead times, and how UCD1J221MNQ1MS can fit into your next design.