UCD1J221MNJ1MS

The UCD1J221MNJ1MS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It delivers 220 µF at 63 V in a compact SMD can package with polarity and is optimized for applications requiring elevated temperature performance and reliable automated assembly.

Built for demanding environments, this capacitor is rated for operation from -55 °C to +105 °C, is AEC-Q200 qualified, and complies with RoHS (2011/65/EU, (EU)2015/863), making it suitable for automotive and other high-reliability applications.

Key Features

• Capacitance & Voltage — 220 µF rated capacitance at 63 V for bulk energy storage and decoupling in power circuits.
• Low-Impedance, High-Frequency Performance — Chip-type, low impedance construction with ripple current ratings of 400 mA at 120 Hz and 800 mA at 10 kHz to support both low- and high-frequency ripple filtering.
• Wide Temperature Range — Operating temperature from -55 °C to +105 °C for use in thermally challenging environments.
• Endurance — Rated lifetime of 5000 hours at 105 °C, supporting long-term stability under elevated temperature stress.
• Package & Mounting — Surface-mount radial can (SMD) package designed for high-density PCBs and compatible with automatic mounting fed by carrier tape.
• Tolerance & Polarization — Capacitance tolerance of -20% to +20% with polarized terminals.
• Reliability & Compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).
• Leakage Current — Per series specification: after 2 minutes' application of rated voltage at 20 °C, leakage current is not more than 0.01 CV or 3 µA, whichever is greater.
• Physical Size — Compact dimensions L: 1.35 × D: 1.25 cm with surface mount land size L: 1.28 × W: 1.28 cm for tight-layout designs.

Typical Applications

• Automotive Electronics — Designed and AEC-Q200 qualified for use in automotive ECUs, body electronics and other vehicle subsystems requiring elevated-temperature operation and robust component qualification.
• High-Density Surface-Mount PCBs — Compact chip-type can for bulk smoothing and decoupling on space-constrained, high-density boards.
• Automated Assembly — Compatible with automatic mounting machines fed by carrier tape to streamline production and reduce handling time.

Unique Advantages

• High-Temperature Durability: Rated for -55 °C to +105 °C and specified for 5000 hours at 105 °C, enabling use in thermally demanding applications.
• AEC-Q200 Qualification: Recognized for automotive-grade reliability where industry qualification is required.
• Low-Impedance Design: Chip-type construction and specified ripple current ratings support effective ripple suppression across low and high frequencies.
• Automated Assembly Ready: Carrier-tape compatibility allows efficient placement in high-volume manufacturing lines.
• Regulatory Compliance: RoHS compliant (2011/65/EU, (EU)2015/863) to meet environmental requirements.
• Compact SMD Can: Small package dimensions and defined PCB land size simplify layout for dense power and control boards.

Why Choose UCD1J221MNJ1MS?

The UCD1J221MNJ1MS combines low impedance performance, compact SMD packaging, and elevated-temperature endurance to address power filtering and decoupling needs in constrained layouts and demanding environments. Its AEC-Q200 qualification and RoHS compliance make it a practical choice for automotive and other high-reliability designs that require traceable component qualifications.

This part is well suited to engineers and procurement teams specifying capacitors for high-density boards and automated assembly where consistent ripple handling, thermal stability, and qualification are required for long-term subsystem reliability.

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