UCD1J220MCS1GS

The UCD1J220MCS1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount use on high-density PC boards. Built for automated assembly and qualified to AEC-Q200, it targets applications where compact SMD electrolytics with defined ripple handling and elevated-temperature endurance are required.

This part provides 22 µF capacitance at a 63 V rating, polarized construction, RoHS compliance, and a guaranteed operating range from −55 °C to 105 °C with specified lifetime performance at elevated temperature.

Key Features

• Form Factor & Mounting: Chip-type SMD (radial, can) package designed for surface mounting on high-density PC boards and compatible with automatic mounting machines fed with carrier tape.
• Electrical Specification: 22 µF nominal capacitance at a 63 V rated voltage with ±20% tolerance; polarized device suitable where polarized bulk or decoupling capacitance is required.
• Low Impedance Construction: Designed as a low-impedance chip type to support stable performance in SMD power and decoupling roles.
• Temperature & Lifetime: Operating temperature range −55 °C to 105 °C and specified lifetime of 2000 hours at 105 °C for the applicable size and voltage.
• Ripple Current Ratings: Rated ripple current of 60 mA at 120 Hz and 120 mA at 10 kHz, enabling predictable AC performance across common frequencies.
• Qualification & Compliance: AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting automotive and regulated-design use cases.
• Compact Dimensions: Component size L: 7.7 × D: 6.3 mm with surface-mount land size L: 6.6 × W: 6.6 mm and a seated height max of 7.7 mm for tight layouts.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification makes this part suitable for automotive electronic modules that require SMD low-impedance capacitors.
• High-Density PCB Designs — Designed for surface mounting on high-density PC boards where compact capacitor footprints and automated placement are required.
• Automated Assembly — Applicable to automatic mounting machines fed with carrier tape to support efficient, repeatable production processes.

Unique Advantages

• AEC-Q200 Qualification: Explicit qualification for automotive-grade reliability supports use in regulated automotive electronics designs.
• Low-Impedance SMD Design: Chip-type construction delivers lower impedance behavior in a compact SMD can, helping maintain stable voltage filtering in constrained board areas.
• Wide Temperature Range: Rated from −55 °C to 105 °C, providing predictable performance across extended environmental conditions.
• Defined High-Temperature Lifetime: Specified lifetime of 2000 hours at 105 °C for the applicable size and voltage, enabling engineering trade-offs for durability in elevated-temperature zones.
• Measurable Ripple Handling: Published ripple current values at 120 Hz and 10 kHz let designers assess AC stress and thermal considerations accurately.
• Manufacturing-Friendly Footprint: SMD package and carrier-tape compatibility simplify integration into automated assembly flows for consistent placement and throughput.

Why Choose UCD1J220MCS1GS?

The UCD1J220MCS1GS combines a low-impedance chip construction, compact SMD packaging, and AEC-Q200 qualification to address demanding designs that require reliable, compact electrolytic capacitance. Its defined ripple ratings, wide operating temperature range, and qualified lifetime at 105 °C provide engineering transparency for thermal and reliability planning.

This part is well suited for engineers and procurement teams specifying SMD electrolytic capacitors for automotive modules, high-density PCB layouts, and automated production environments where compliance, predictable performance, and compactness are key selection criteria.

Request a quote or contact sales to discuss availability, lead times, and pricing for the UCD1J220MCS1GS.