UCD1K101MNQ1MS

The UCD1K101MNQ1MS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It combines a high rated voltage with wide operating temperature range and series-level endurance characteristics suited to demanding environments.

Engineered for automated SMD assembly and compliant with industry environmental and reliability standards, this part supports applications where temperature resilience, ripple handling and automotive qualification are required.

Key Features

• Capacitance & Rated Voltage — 100 µF nominal capacitance with an 80 V rated voltage and tolerance of ±20% (‑20% to +20%).
• Chip Type, Low Impedance — Chip-style aluminum electrolytic construction specified for low impedance performance within the UCD series.
• Temperature & Endurance — Rated for operation from ‑55 °C to +105 °C with a specified lifetime of 5000 hours at 105 °C for applicable size/voltage conditions.
• Ripple Current Performance — Specified ripple current of 250 mA at 120 Hz and 500 mA at 10 kHz to address AC stress in power circuits.
• Leakage & Loss Characteristics — Leakage current: after 2 minutes at rated voltage and 20 °C, not more than 0.01 CV or 3 µA (whichever is greater); tangent of loss angle (tan δ) for 80 V is specified in the series data.
• Package & Mounting — Radial, can-style SMD package for surface mount; designed for automatic mounting machines fed with carrier tape and compatible with high-density PCB layouts.
• Physical Dimensions & Land Pattern — Component size L: 1.35 × D: 1.25 cm; recommended surface-mount land size L: 1.28 × W: 1.28 cm.
• Compliance & Qualification — RoHS compliant and AEC‑Q200 qualified for designs requiring automotive-grade component qualification.

Typical Applications

• Automotive Electronics — Suitable for automotive systems requiring AEC‑Q200 qualified passives and tolerance to elevated operating temperatures.
• High‑Density Power Modules — Designed for surface mounting on compact PCBs where low impedance and reliable ripple handling are needed.
• Automated SMD Assembly — Compatible with carrier tape feed for automatic placement in volume manufacturing of electronic assemblies.

Unique Advantages

• AEC‑Q200 Qualification: Supports automotive design requirements for passive components, enabling use in safety- and reliability-focused applications.
• High Temperature Endurance: Rated operation to +105 °C with up to 5000 hours endurance at that temperature for applicable sizes, providing long-term stability under elevated thermal stress.
• Low‑Impedance Chip Design: Series-level low impedance construction combined with specified ripple current ratings helps manage AC stress in power circuits.
• SMD-Ready Packaging: Radial can SMD format and carrier-tape compatibility simplify automated placement on high-density PCBs.
• Regulatory Compliance: RoHS compliance ensures alignment with environmental requirements for many commercial and automotive supply chains.

Why Choose UCD1K101MNQ1MS?

The UCD1K101MNQ1MS delivers a combination of low impedance, high voltage rating and temperature endurance in a compact chip-style aluminum electrolytic package. Its AEC‑Q200 qualification and RoHS compliance make it an appropriate choice for automotive and other demanding designs that require verified reliability and environmental conformance.

This part is well suited to engineers specifying SMD capacitors for high-density boards and automated assembly processes who need verifiable ripple handling, defined leakage and endurance characteristics backed by the UCD series specifications.

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