UCD1K151MNQ1MS

The UCD1K151MNQ1MS is a surface‑mount, chip‑type aluminum electrolytic capacitor from Nichicon’s UCD series. It delivers 150 µF capacitance at an 80 V rating in a compact radial can SMD package designed for high‑density PCB assembly.

Engineered for demanding thermal and endurance requirements, this component supports operation from −55 °C to +105 °C with endurance up to 5000 hours at 105 °C. It is AEC‑Q200 qualified and RoHS compliant, making it suitable for reliability‑focused electronic designs.

Key Features

• Capacitance and Voltage — 150 µF nominal capacitance with an 80 V rated voltage and tolerance of −20% to +20% for predictable energy storage.
• Low Impedance Chip Type — Designed as a chip‑type, low impedance SMD capacitor; rated tan δ (loss tangent) is 0.08 measured at 20 °C and 120 Hz for stable AC performance.
• High Frequency & Low Frequency Ripple Handling — Specified ripple current capability of 250 mA at 120 Hz (low frequency) and 500 mA at 10 kHz (high frequency) to support filtering and decoupling tasks across a range of switching frequencies.
• Leakage Current — Leakage current specified at 120 µA to help manage quiescent current in sensitive circuits.
• Robust Thermal and Endurance Specs — Operating temperature range from −55 °C to +105 °C and endurance rated at 5000 hours at 105 °C for long‑life performance in elevated temperature environments.
• Compact SMD Package — Physical size φ12.5 × 13.5 mm (L: 1.35 × D: 1.25 cm) in a radial, can‑style SMD case with surface mount land size of 1.28 × 1.28 cm for automated assembly.
• Assembly‑Ready Packaging — Supplied in embossed carrier taping and applicable to automatic mounting machines for high‑volume production.
• Quality and Compliance — AEC‑Q200 qualification and RoHS compliance for regulated and reliability‑sensitive applications.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and extended thermal endurance make it suitable for vehicle electronic modules requiring stable capacitance at elevated temperatures.
• High‑Density PCB Assemblies — Chip‑type SMD form factor and embossed carrier taping support automatic placement on compact, densely populated boards.
• Temperature‑Stress Environments — Rated for −55 °C to +105 °C and 5000 hours endurance at 105 °C, appropriate for systems subject to prolonged high‑temperature operation.

Unique Advantages

• High Voltage Handling: 80 V rating enables designs requiring elevated DC link or bulk storage voltages without resorting to multiple lower‑voltage capacitors.
• Long Endurance at Elevated Temperature: 5000 hours at 105 °C provides predictable lifetime behavior for thermal‑stress applications.
• Optimized AC Performance: Low tan δ (0.08 at 120 Hz, 20 °C) and defined ripple current specs support stable filtering across low and high frequencies.
• Automated Assembly Ready: Embossed carrier taping and SMD radial can format are suitable for high‑volume automated placement.
• Industry Compliance: AEC‑Q200 qualification and RoHS compliance help meet regulatory and reliability requirements for professional designs.

Why Choose UCD1K151MNQ1MS?

The UCD1K151MNQ1MS combines a compact surface‑mount radial can with substantial capacitance (150 µF) and an 80 V rating, targeted at engineers who need durable, low‑impedance electrolytic capacitors for thermally demanding or regulated applications. Its specified ripple performance, low loss tangent, and long endurance at 105 °C make it a practical option where stability under stress and automated assembly are priorities.

Manufactured by Nichicon and conforming to AEC‑Q200 and RoHS, this part is positioned for designs that require traceable quality and endurance. It is well suited for electronics teams designing high‑density assemblies and systems operating across a wide temperature range.

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