UCD1K470MNS1GS

The UCD1K470MNS1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor from Nichicon’s UCD series, optimized for surface‑mount applications. It combines a compact φ10 × 10 mm can package with an 80 V rating and 47 µF capacitance to serve high‑density PCB designs requiring robust performance across a wide temperature range.

Designed for automated assembly and demanding environments, this part targets automotive and industrial applications where AEC‑Q200 qualification, vibration resistance, and a 2000 hour endurance at 105°C are required.

Key Features

• Capacitance & Voltage — 47 µF capacitance with an 80 V rated voltage and ±20% tolerance, suitable for mid‑voltage SMD designs.
• Low Impedance Performance — Chip‑type, low impedance construction with specified tanδ of 0.08 (measured at 20°C, 120 Hz).
• Ripple Current Ratings — Low‑frequency ripple current 100 mA (120 Hz) and high‑frequency ripple current 200 mA (10 kHz), specified for application‑level filtering considerations.
• Thermal & Endurance — Operating temperature range −55°C to +105°C with a rated endurance of 2000 hours at 105°C.
• Leakage Current — Specified leakage current of 37.6 µA (measured after rated voltage application conditions as defined in the datasheet).
• Package & Mounting — φ10 × 10 mm radial can in an SMD chip form factor, supplied in embossed carrier taping compatible with automatic mounting machines.
• Reliability & Ruggedness — Vibration resistant construction and AEC‑Q200 qualification to support demanding system environments.
• Compliance — RoHS compliant.

Typical Applications

• Automotive electronic modules — AEC‑Q200 qualification and vibration resistance make it suitable for use in automotive electronics where SMD low‑impedance capacitors are required.
• High‑density PCBs — Chip‑type surface‑mount design is intended for placement on high‑density circuit boards and automatic assembly processes.
• Engineered assemblies with automated mounting — Supplied in embossed carrier taping for compatibility with automatic mounting machines in production lines.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q200 rating provides a verified qualification level for use in automotive and other high‑reliability applications.
• Compact, high‑voltage SMD form: 47 µF at 80 V in a φ10 × 10 mm chip package saves board area while delivering mid‑voltage capability.
• Designed for automated production: Embossed carrier taping and SMD chip format streamline pick‑and‑place and reflow assembly workflows.
• Wide temperature tolerance and endurance: −55°C to +105°C range with 2000 hours at 105°C supports long‑life operation in elevated temperatures.
• Vibration resistant construction: Mechanical robustness helps maintain reliability in vibration‑prone environments.
• Measurable ripple and leakage specs: Specified ripple current and leakage current values allow predictable behavior in filtering and decoupling designs.

Why Choose UCD1K470MNS1GS?

UCD1K470MNS1GS is positioned for engineers and procurement teams seeking a compact, surface‑mount aluminum electrolytic capacitor that balances capacitance, voltage capability, and ruggedness. Its low‑impedance, chip‑type design and AEC‑Q200 qualification make it a practical choice for high‑density assemblies and automotive electronics where controlled electrical performance and mechanical durability matter.

From production‑friendly embossed carrier taping to defined ripple, leakage, and endurance specifications, this Nichicon UCD series part offers predictable, verifiable characteristics for designs requiring a reliable SMD electrolytic solution.

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