UCD1K4R7MCL1GS

The UCD1K4R7MCL1GS is a surface-mount, chip-type aluminum electrolytic capacitor offering 4.7 µF capacitance with an 80 V rated voltage. Designed for low impedance performance and surface mounting on high-density PC boards, it targets applications that require compact high-voltage capacitance in automated assembly environments.

Manufactured by Nichicon and AEC-Q200 qualified, this part combines a small SMD can package with specifications that address elevated temperature endurance and low-loss operation for demanding electronic modules.

Key Features

• Capacitance & tolerance — 4.7 µF nominal capacitance with tolerance of −20% to +20% at 120 Hz, 20°C.
• Rated voltage & polarization — 80 V rated voltage; polarized aluminum electrolytic construction.
• Low impedance and loss — Specified impedance of 3 Ω and tangent of loss angle (tan δ) of 0.08 measured at 80 V, 120 Hz, 20°C for reduced AC loss and improved filtering performance.
• Ripple current capability — Low-frequency ripple current 20 mA (120 Hz) and high-frequency ripple current 40 mA (10 kHz) for handling AC ripple in power circuits.
• Temperature & endurance — Wide operating range from −55°C to +105°C and rated life of 2000 hours at 105°C.
• Package & mounting — Chip-type SMD radial can (φ6.3 × 5.8 mm) suitable for surface-mount on high-density PCBs; supplied in embossed carrier taping for automated pick-and-place.
• Leakage current — Specified leakage current of 3.76 µA, supporting low off-state loss in DC applications.
• Standards & compliance — AEC-Q200 qualification and RoHS compliant.

Typical Applications

• Automotive electronics — Use in automotive electronic modules where an 80 V rated SMD capacitor and AEC-Q200 qualification are required.
• High-density surface-mount PCBs — Designed for placement on compact, high-density board layouts that need a small, high-voltage electrolytic capacitor.
• Automated assembly lines — Supplied in embossed carrier taping and compatible with automatic mounting machines for streamlined manufacturing.

Unique Advantages

• Compact high-voltage SMD form factor — φ6.3 × 5.8 mm can size and defined land footprint (6.6 × 6.6 mm) enable space-efficient board designs.
• Low impedance and low loss — 3 Ω impedance and tan δ of 0.08 at specified test conditions reduce AC loss and improve filtering effectiveness.
• Designed for harsh environments — −55°C to +105°C operating range and 2000-hour endurance at 105°C support use in elevated-temperature applications.
• Automotive-grade reliability — AEC-Q200 qualification provides an explicitly stated level of automotive suitability.
• Assembly-ready packaging — Embossed carrier taping facilitates automated pick-and-place and high-volume production.
• Regulatory compliance — RoHS compliant for environmental and regulatory compatibility.

Why Choose UCD1K4R7MCL1GS?

UCD1K4R7MCL1GS positions itself as a compact, low-impedance aluminum electrolytic solution for designers needing 4.7 µF at 80 V in a surface-mount package. Its combination of low loss (tan δ 0.08), defined ripple handling, AEC-Q200 qualification, and elevated temperature endurance makes it suitable for demanding electronic modules, particularly in automotive and industrial assemblies.

As a mass-production Nichicon part supplied in embossed carrier tape and optimized for high-density PCB mounting, it supports streamlined manufacturing and long-term deployment in applications that require reliable, compact high-voltage capacitance.

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