UCD1V100MCL6GS

The UCD1V100MCL6GS is a chip-style, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It delivers 10 µF capacitance at a 35 V rating in a compact SMD radial can package engineered for automated tape-fed placement.

Built for temperature resilience and long-term operation, this part supports an operating range of −55 °C to +105 °C, is RoHS compliant, and is AEC-Q200 qualified for automotive applications where board-level power smoothing and decoupling are required.

Key Features

• Chip-style, low impedance construction — Engineered for reduced ESR and stable performance in power decoupling and smoothing roles; specified impedance 1.35 Ω.
• Electrical specifications — 10 µF capacitance with ±20% tolerance and 35 V rated voltage; polarized design for DC applications.
• Temperature and endurance — Rated for −55 °C to +105 °C operation with a specified lifetime of 2000 hours at 105 °C.
• Ripple handling — Specified ripple currents of 45 mA at 120 Hz and 90 mA at 10 kHz for handling AC ripple in power rails.
• Surface-mount package — Radial can SMD package (L: 5.8 × D: 4 mm) optimized for high-density PCBs; surface mount land size 4.3 × 4.3 mm for PCB footprint planning.
• Manufacturing compatibility — Designed for automatic mounting machines fed with carrier tape to support high-volume assembly.
• Quality and compliance — Compliant with RoHS (2011/65/EU, (EU)2015/863) and qualified to AEC-Q200.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and −55 °C to +105 °C rating make this part suitable for control modules and in-vehicle power circuits that require SMD capacitors.
• Power supply decoupling — Low impedance and specified ripple current make it well suited for local smoothing on DC power rails and regulator outputs.
• High-density PCB assemblies — Compact chip-style can and tape-fed placement support tight board layouts and automated manufacturing.

Unique Advantages

• AEC-Q200 qualified: Provides an industry-recognized reliability baseline for automotive and other demanding environments.
• Wide temperature range: −55 °C to +105 °C operation supports designs that encounter harsh thermal conditions.
• Tape-fed SMD compatibility: Designed for automated placement to streamline assembly and reduce production cycle time.
• Compact footprint: Small L: 5.8 × D: 4 mm package with a 4.3 × 4.3 mm land pattern helps minimize PCB area.
• Measurable ripple performance: Published ripple current ratings at 120 Hz and 10 kHz allow designers to size components against expected AC stress.
• RoHS compliant: Meets current environmental directives for lead-free assembly and regulatory compliance.

Why Choose UCD1V100MCL6GS?

The UCD1V100MCL6GS combines compact SMD packaging, low impedance performance, and automotive-grade qualification to support reliable power decoupling in space-constrained and temperature-challenging designs. Its specification set — including 10 µF at 35 V, defined ripple current values, and a 2000-hour life at 105 °C — makes it a practical choice for engineers needing verifiable electrical and endurance characteristics.

This part is well suited to electronics manufacturers and design teams targeting automotive modules, industrial controllers, and high-density consumer or professional equipment where automated assembly, regulatory compliance, and thermal endurance are key considerations.

If you need pricing, availability, or support for volume requirements, request a quote or contact sales to discuss your application and ordering details.