UCD1V101MNS1GS

The UCD1V101MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount use on high-density PC boards. With a 100 µF capacitance at 35 V, a temperature rating from −55 °C to 105 °C, and AEC-Q200 qualification, it targets demanding applications that require stable capacitance, controlled loss, and robust thermal endurance.

Its compact φ8 × 10 mm can, low leakage and specified ripple-current performance make it suitable for automated assembly environments and systems where long-term durability at elevated temperature is required.

Key Features

• Capacitance & Voltage: 100 µF nominal capacitance with ±20% tolerance, rated for 35 V operation.
• Low‑Impedance Chip Design: Chip-type construction optimized for reduced impedance and lower tan δ (0.12 at 20 °C, 120 Hz), supporting improved AC performance.
• Ripple Current Performance: Specified low-frequency ripple current of 300 mA at 120 Hz and high-frequency ripple current of 600 mA at 10 kHz for filtered and switching environments.
• Leakage Current: Low leakage current specified at 35 µA, supporting stable DC behavior in power circuits.
• Thermal Endurance: Rated operating temperature −55 °C to 105 °C with an endurance life of 5000 hours at 105 °C.
• Compact Surface‑Mount Package: φ8 × 10 mm chip can in a surface-mount radial can configuration with recommended land size 8.3 × 8.3 mm; supplied in embossed carrier tape for automated placement.
• Reliability & Compliance: AEC-Q200 qualified and RoHS compliant, and designed for vibration-resistant applications.

Typical Applications

• Automotive Electronics: Suitable for automotive systems where AEC-Q200 qualification, extended temperature range, and 5000 h endurance at 105 °C are required.
• High‑Density SMD Assemblies: Chip-type SMD construction and embossed carrier taping enable placement on compact, high-density PCBs.
• Automated Production Lines: Package and tape format support automatic mounting machines for efficient volume assembly.

Unique Advantages

• Engineered for low impedance: Chip-type construction and specified tan δ reduce AC losses and help manage ripple-related heating.
• Defined ripple handling: Clear low- and high-frequency ripple current ratings (300 mA at 120 Hz, 600 mA at 10 kHz) provide predictable performance in power filtering and converter circuits.
• High-temperature durability: Rated to operate from −55 °C to 105 °C with 5000 hours endurance at 105 °C, supporting long-term operation in elevated-temperature environments.
• SMD-ready packaging: Embossed carrier tape packaging and a compact φ8 × 10 mm case streamline automated assembly and PCB layout.
• Industry qualification and compliance: AEC-Q200 qualification and RoHS compliance address regulatory and reliability requirements for regulated markets.

Why Choose UCD1V101MNS1GS?

The UCD1V101MNS1GS positions itself as a robust SMD aluminum electrolytic option where low impedance, defined ripple capabilities, and thermal endurance are needed. Its chip-type format and embossed carrier tape make it practical for high-density boards and automated assembly workflows.

Engineers designing systems that require AEC-Q200 qualification, extended temperature operation, and a predictable endurance profile will find this capacitor well suited to applications demanding stable capacitance, controlled losses, and reliable long-term performance.

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