UCD1V102MNQ1MS

The UCD1V102MNQ1MS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly on high-density PCBs. It provides 1000 µF capacitance at a 35 V rating with a wide operating temperature range from −55°C to +105°C.

Built for automated production, this part supports embossed carrier taping for pick-and-place mounting and carries AEC-Q200 qualification and RoHS compliance for demanding electronic assemblies.

Key Features

• Core Electricals — 1000 µF capacitance with tolerance −20% to +20% and a rated voltage of 35 V, offering substantial bulk capacitance for power applications.
• Low Impedance & Loss — Chip-type, low-impedance construction with tan δ (DF) 0.12 measured at 20°C, 120 Hz, for improved AC performance in filtering and decoupling.
• Ripple Current Capability — Low-frequency ripple current of 900 mA (120 Hz) and high-frequency ripple current of 1.8 A (10 kHz), supporting dynamic load conditions.
• Leakage Current — Specified leakage current of 350 µA, suitable for power rail and bulk storage roles where controlled leakage is required.
• Thermal & Endurance — Rated for operation from −55°C to +105°C with an endurance of 5000 hours at 105°C, enabling long service life in elevated-temperature installations.
• Packaging & Mounting — Surface-mount radial can (φ16 × 16.5L) supplied in embossed carrier taping for automated placement; surface-mount land size 1.63 × 1.63 cm.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant, aligning with automotive-grade qualification and environmental directives.

Typical Applications

• Automotive Electronic Modules — AEC-Q200 qualification and a −55°C to +105°C rating make this capacitor suitable for surface-mount power components in automotive electronic control units and modules that require reliable bulk capacitance at 35 V.
• Surface-Mount Power Filtering — Chip-type, low-impedance design and high ripple-current capability support bulk filtering and decoupling on high-density PCBs used in power-supply sections.
• High-Density PCB Assemblies — Specifically designed for surface mounting on high-density circuit boards and compatible with automatic placement using embossed carrier tape.

Unique Advantages

• High Bulk Capacitance at SMD Form Factor: 1000 µF in a φ16 × 16.5L chip package reduces board area compared with through-hole equivalents while maintaining capacitance needed for power rails.
• Designed for Automated Assembly: Embossed carrier taping and surface-mount compatibility simplify integration into automated production lines.
• Robust Thermal Endurance: 5000 hours at 105°C provides predictable long-term behavior in elevated-temperature environments.
• Broad Ripple-Handling Range: Defined low- and high-frequency ripple currents (900 mA at 120 Hz, 1.8 A at 10 kHz) support a range of real-world switching and AC conditions.
• Automotive-Grade Qualification: AEC-Q200 rating supports use in automotive assemblies that require component-level qualification.
• Regulatory Compliance: RoHS compliance ensures alignment with environmental regulations for electronic components.

Why Choose UCD1V102MNQ1MS?

UCD1V102MNQ1MS positions itself as a rugged, chip-type aluminum electrolytic capacitor that bridges high bulk capacitance and surface-mount convenience. With a 35 V rating, low impedance characteristics, defined ripple-current performance, and a wide −55°C to +105°C operating range, it is suited to designs that demand stable bulk energy storage and filtering in compact, automated assemblies.

The combination of AEC-Q200 qualification, embossed carrier taping for pick-and-place, and 5000-hour endurance at 105°C delivers long-term reliability for engineers developing automotive and other high-reliability electronic systems.

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