UCD2A331MNS1MS

The UCD2A331MNS1MS is a chip‑type aluminum electrolytic capacitor from Nichicon's UCD series designed for surface mounting on high‑density PC boards. It delivers 330 µF at 100 V in an SMD radial can package with low impedance characteristics and a wide operating temperature range suitable for demanding environments.

Targeted at automotive and high‑reliability electronics, the part combines AEC‑Q200 qualification, RoHS compliance, and tape‑and‑reel assembly compatibility to support automated production and long‑term endurance at elevated temperatures.

Key Features

• Electrical Performance — 330 µF rated capacitance with a 100 V rated voltage and ±20% tolerance, providing stable bulk capacitance for power applications.
• Low Impedance Design — Chip‑type construction optimized for low impedance; ripple current ratings of 458.5 mA at 120 Hz and 917 mA at 10 kHz support AC stress handling.
• Wide Temperature Range — Operates from −55 °C to +105 °C, enabling use in thermally challenging applications.
• Endurance at Elevated Temperature — Specified lifetime of 5000 hours at 105 °C, supporting long‑term reliability under high‑temperature operation.
• Automotive Qualification — AEC‑Q200 qualification for applications requiring automotive‑grade componentry.
• Surface Mount Package — Radial can SMD package (L: 1.65 × D: 1.8 cm) designed for high‑density PCBs and compatible with carrier‑tape automated assembly.
• Leakage and Loss Characteristics — Leakage current specified as not more than 0.01 CV or 3 µA (after 2 minutes at 20 °C) and controlled tan δ values per rated voltage, as detailed in the series datasheet.
• Environmental Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suitable for automotive modules and control systems where AEC‑Q200 qualification and extended temperature endurance are required.
• High‑Density Surface‑Mount Boards — Chip‑type SMD format is designed for compact PCB layouts and space‑constrained power sections.
• Automated High‑Volume Assembly — Compatible with carrier‑tape feeding for pick‑and‑place processes, simplifying production for large volumes.

Unique Advantages

• AEC‑Q200 Qualified: Meets automotive qualification requirements to support designs with elevated reliability expectations.
• High Temperature Endurance: Rated for 5000 hours at 105 °C, enabling sustained operation in hot environments.
• Low Impedance and Ripple Handling: Engineered for low impedance with specified ripple current values at both 120 Hz and 10 kHz to support AC and dynamic loads.
• SMD Radial Can Footprint: Compact L × D dimensions and defined land pattern (1.83 × 1.83 cm) reduce PCB area while remaining compatible with automated assembly.
• Controlled Leakage and Loss: Leakage current limits and tan δ specifications help preserve efficiency and predictability in power circuits.
• RoHS Compliance: Environmentally compliant material selection for regulated markets.

Why Choose UCD2A331MNS1MS?

The UCD2A331MNS1MS blends the electrical performance of a low‑impedance aluminum electrolytic with the manufacturability of an SMD chip‑type package. Its 330 µF/100 V rating, defined ripple capacities, wide −55 °C to +105 °C operating range, and 5000‑hour endurance at 105 °C make it a practical choice where sustained bulk capacitance and thermal reliability are required.

With AEC‑Q200 qualification and tape‑and‑reel compatibility, this capacitor is well suited for designers targeting automotive and other high‑reliability markets that demand automated assembly, compact PCB integration, and verifiable electrical performance.

For pricing, availability, or to request a quote for UCD2A331MNS1MS, please contact our sales team or submit a request for quotation.