UCD2A470MNJ1MS
| Part Description |
47 µF 100 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,754 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 47 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.45 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 5000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 500 mA @ 10 kHz | Ripple Current Low Frequency | 250 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 13.5 x 12.5 mm | Surface Mount Land Size | 12.8 x 12.8 mm | ||
| Tolerance | -20%~20% | Voltage | 100 V |
Overview of UCD2A470MNJ1MS – Chip Type Low Impedance Aluminum Electrolytic Capacitor
The UCD2A470MNJ1MS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly. It delivers 47 µF capacitance at a 100 V rating with a temperature range of −55°C to +105°C and is produced for high-density PCB applications.
Built for reliability in demanding environments, this Nichicon UCD series part offers low loss (tanδ = 0.07 at 20°C, 120 Hz), measurable ripple current capability, and AEC-Q200 qualification for automotive-grade system use. It is supplied in embossed carrier taping for automated placement and is in mass production.
Key Features
- Capacitance & Tolerance — 47 µF nominal capacitance with a tolerance of −20% to +20%.
- Rated Voltage — 100 V rated voltage for higher-voltage DC bus and power filtering applications.
- Low Impedance / Low Loss — Designed as a low-impedance chip type; tangent of loss angle (tanδ) specified at 0.07 (measured at 20°C, 120 Hz).
- Ripple Current Performance — Supports 250 mA at 120 Hz (low frequency) and 500 mA at 10 kHz (high frequency) for effective ripple smoothing and decoupling.
- Leakage Current — Specified leakage current of 47 µA after rated voltage application, enabling predictable standby behavior.
- Temperature & Endurance — Operating range −55°C to +105°C with endurance rated to 5000 hours at 105°C.
- Package & Assembly — Surface-mount radial can (chip type) with size φ12.5 × 13.5L (12.5 mm diameter × 13.5 mm length); supplied in embossed carrier taping for automated pick-and-place.
- Compliance & Qualification — RoHS compliant and AEC-Q200 qualified.
Typical Applications
- Automotive power electronics — Suited for power filtering and decoupling in automotive modules where AEC-Q200 qualification and operation to 105°C are required.
- High-density surface-mount assemblies — Chip-type can format and carrier-tape packaging enable automated placement on densely populated PCBs.
- Power supply ripple suppression — Low impedance and specified ripple current ratings support smoothing of DC bus and local regulator outputs.
Unique Advantages
- Automotive-grade qualification: AEC-Q200 qualification provides documented suitability for applications requiring automotive component standards.
- High-temperature endurance: Rated for 5000 hours at 105°C, offering predictable long-term performance in elevated-temperature environments.
- Defined ripple handling: Separate low- and high-frequency ripple current specifications (250 mA @120 Hz, 500 mA @10 kHz) allow designers to quantify AC stress and thermal management.
- Low loss for stable filtering: tanδ of 0.07 at 20°C/120 Hz supports efficient energy storage with reduced dissipation in filtering roles.
- SMD-ready packaging: Embossed carrier taping and chip-type SMD format streamline automated assembly for high-volume production.
- Regulatory compliance: RoHS compliance supports use in regulated markets and simplifies end-product approvals.
Why Choose UCD2A470MNJ1MS?
UCD2A470MNJ1MS combines a compact chip-type SMD package with low impedance performance and durable operation to +105°C, making it a practical choice where power filtering, decoupling, and reliable long-term operation are required. Its AEC-Q200 qualification and RoHS compliance make it appropriate for engineered systems that demand traceable component standards and environmental compliance.
This part is well suited to designers and procurement teams building high-density electronic assemblies, automotive power modules, and other systems where defined ripple handling, low loss, and robust thermal endurance are priorities. Supplied in embossed carrier tape and in mass production, it supports automated placement and volume manufacturing.
Request a quote or contact sales to discuss availability, volume pricing, and to evaluate UCD2A470MNJ1MS for your design needs.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016