UCH1V331MCL1GS
| Part Description |
330 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 909 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCH |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 330 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 150 mOhm @ 100 kHz | Height Seated (Max) | 1.05 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 125°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 125°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 500 mA @ 10 kHz | Ripple Current Low Frequency | 250 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 10 mm | Surface Mount Land Size | 10.3 x 10.3 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UCH1V331MCL1GS – Chip Aluminum Electrolytic Capacitor, 330 µF / 35 V
The UCH1V331MCL1GS is a high-reliability, chip-type aluminum electrolytic capacitor in a surface-mount can. It delivers 330 µF at 35 V with polarized construction and is designed for use in systems that require qualified components and robust thermal performance.
Key value comes from its extended temperature range (−40°C to 125°C), AEC-Q200 qualification, low-temperature ESR specification, and compatibility with automated PCB assembly processes.
Key Features
- Electrical Performance — 330 µF capacitance at 35 V with ±20% tolerance; polarized aluminum electrolytic construction.
- Low-Temperature ESR — Specified ESR of 150 mΩ at 100 kHz and an added ESR specification after the −40°C test to maintain performance in cold environments.
- Ripple Current Handling — Rated ripple current of 250 mA at 120 Hz and 500 mA at 10 kHz, with published frequency coefficients for ripple-current scaling.
- Temperature and Lifetime — Operating range −40°C to +125°C with endurance rating of 2000 hours at 125°C; endurance limits include capacitance change within ±30% and leakage current within initial specification after test.
- Reliability & Qualification — AEC-Q200 qualified and RoHS compliant, with leakage current specified as not more than 0.01CV (µA) after 2 minutes at 20°C.
- Surface-Mount Packaging — Chip-type, radial can SMD package designed for automatic mounting machines fed with carrier tape; case marked with black print on the top for clear identification.
- Board Design Dimensions — Component size L: 1 × D: 1 cm with recommended surface-mount land size L: 1.03 × W: 1.03 cm.
Typical Applications
- Automotive systems — Suited for automotive electronic modules where AEC-Q200 qualification and wide temperature range are required.
- Surface-mount production — Designed for automated PCB assembly using carrier-tape fed pick-and-place equipment.
- High-temperature endurance modules — Appropriate for designs that require sustained operation up to 125°C and defined 2000-hour endurance performance.
Unique Advantages
- Qualified for demanding environments: AEC-Q200 qualification provides documented reliability for qualified electronic applications.
- Low-temperature performance: Added ESR specification after −40°C testing and a measured ESR of 150 mΩ at 100 kHz reduce uncertainty in cold-start or low-temperature conditions.
- Clear thermal and lifetime specs: Rated for −40°C to +125°C operation with a 2000-hour endurance rating at 125°C, enabling predictable long-term behavior.
- Automated assembly ready: Chip form factor and carrier-tape compatibility simplify integration into high-volume surface-mount production flows.
- RoHS compliant: Meets current RoHS directive requirements for material compliance.
- Documented ripple performance: Published ripple-current ratings and frequency coefficients support accurate thermal and ripple budgeting in designs.
Why Choose UCH1V331MCL1GS?
UCH1V331MCL1GS combines a compact chip-type SMD package with verified environmental and electrical performance metrics—330 µF at 35 V, low-temperature ESR verification, and AEC-Q200 qualification—making it a suitable choice for engineers who need traceable reliability and clear specifications. Its compatibility with automated placement and explicit ripple and endurance ratings help reduce design uncertainty and support predictable production outcomes.
This part is well suited to teams designing qualified automotive modules and other high-reliability electronic assemblies that require qualified components, long-term thermal endurance, and documented electrical characteristics.
Request a quote or contact sales to discuss availability, lead times, and volume pricing for UCH1V331MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016