UCH1V331MCS1GS

The UCH1V331MCS1GS is a chip-type aluminum electrolytic capacitor in Nichicon’s UCH series, designed for high-reliability surface-mount applications. It delivers 330 µF at 35 V in a compact SMD can package optimized for automated assembly and demanding thermal environments.

Key value propositions include low-temperature ESR characterization, AEC-Q200 qualification for demanding systems, and rated operation across a broad temperature range up to 125°C—features that support robust performance in automotive and other high-reliability designs.

Key Features

• Capacitance & Voltage — 330 µF rated capacitance at 35 V with a capacitance tolerance of ±20% (120 Hz, 20°C).
• Temperature Range & Endurance — Rated for operation from −40°C to +125°C with an endurance specification of 2000 hours at 125°C.
• Low-temperature ESR — Low temperature ESR specification with an added ESR evaluation after the −40°C test; nominal ESR 150 mΩ measured at 100 kHz for this part.
• Ripple Current Capability — Specified ripple current of 250 mA at 120 Hz and 500 mA at 10 kHz; frequency coefficients provided for ripple current scaling across frequency (e.g., 0.50 at 120 Hz, 1.00 at ≥10 kHz).
• Leakage & Loss Characteristics — Leakage current limit: after 2 minutes at rated voltage and 20°C, I ≤ 0.01 × C × V (µA); tan δ (loss tangent) for 35 V parts specified at 0.16 (max) at 120 Hz, 20°C.
• Package & Assembly — Chip-type radial can SMD package suitable for placement from carrier tape and automatic mounting machines; black top marking for part identification.
• Compliance & Qualification — AEC-Q200 qualified and RoHS compliant.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and a −40°C to +125°C rating make this capacitor suitable for control modules and electronic subsystems that require automotive-grade components.
• Surface-mount Production — Designed for automatic mounting from carrier tape, enabling high-volume SMT assembly and consistent placement on PCBs.
• High-temperature Electronics — Endurance tested for 2000 hours at 125°C, supporting use in applications with sustained elevated operating temperatures.
• Compact Power Filtering — Chip can SMD package provides bulk capacitance in a small footprint for decoupling and smoothing in space-constrained power designs.

Unique Advantages

• Low-temperature ESR characterization: Added ESR specification after −40°C testing provides verifiable cold-start and low-temperature behavior for designers.
• AEC-Q200 qualification: Supports designs that require component-level reliability validation for automotive or other high-reliability markets.
• High-temperature endurance: 2000 hours at 125°C endurance and defined post-test limits for capacitance, tan δ and leakage current help ensure long-term stability in hot environments.
• SMD-ready packaging: Compatible with automatic mounting machines using carrier tape, simplifying integration into automated production lines.
• Measured electricals: Explicit ESR (150 mΩ at 100 kHz), ripple current ratings at multiple frequencies, and a defined leakage current formula allow predictable electrical design margins.
• Regulatory compliance: RoHS compliance reduces material-restriction risk for global product shipments.

Why Choose UCH1V331MCS1GS?

The UCH1V331MCS1GS combines compact chip-package convenience with specifications aimed at reliable performance in temperature-challenging and automated-production environments. Its low-temperature ESR data, defined ripple and leakage characteristics, and AEC-Q200 qualification make it a clear choice where predictable electrical behavior and component-level reliability are required.

This part is well suited to engineers and procurement teams building systems that demand robust SMD bulk capacitance—particularly in automotive and other high-reliability markets—providing measurable long-term value through documented endurance and compliance attributes.

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