UCJ1E101MCL1GS

CAP ALUM 100UF ±20% 25V SMD
Part Description

100 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,100 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCJ
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance100 µFECCNEAR99
ESRN/AHeight Seated (Max)1.05 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 125°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 125°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency250 mA @ 10 kHzRipple Current Low Frequency125 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension10 x 8 mmSurface Mount Land Size8.3 x 8.3 mm
Tolerance-20%~20%Voltage25 V

Overview of UCJ1E101MCL1GS – Chip Type, High-Reliability Aluminum Electrolytic Capacitor

The UCJ1E101MCL1GS is a surface-mount, chip-type aluminum electrolytic capacitor designed for high-reliability, high-temperature applications. With a rated capacitance of 100 µF at 25 V, a -40 °C to +125 °C operating range and AEC‑Q200 qualification, it is intended for demanding electronics where elevated temperature endurance and stable electrical performance at low temperature are required.

Key value propositions include long-term operation at +125 °C (2000 hours rated endurance), a low-temperature ESR specification, and compatibility with automated tape-fed pick-and-place assembly.

Key Features

  • Form Factor & Package — Chip-type, surface-mount radial can SMD package with a compact footprint (L: 1.0 cm × D: 0.8 cm) and recommended land pattern L: 8.3 × W: 8.3 mm for PCB layout.
  • Rated Electricals — 100 µF capacitance at 25 V with ±20% tolerance and polarized construction suitable for DC smoothing and decoupling in power circuitry.
  • Temperature Range & Endurance — Specified for operation from -40 °C to +125 °C with a rated lifetime of 2000 hours at 125 °C.
  • Low-Temperature ESR and Impedance Stability — Added ESR specification after -40 °C testing; impedance ratio Z(-40 °C)/Z(+20 °C) for 25 V parts is 6, supporting performance in cold conditions.
  • Ripple Current Ratings — Rated ripple current of 125 mA at 120 Hz and 250 mA at 10 kHz for filtering and smoothing applications across low and higher frequency ranges.
  • Reliability & Standards — AEC‑Q200 qualified and RoHS compliant; leakage current specified after 1 minute at 20 °C as ≤ 0.03CV or 4 µA (whichever is greater).
  • Soldering and Storage Robustness — Meets resistance to soldering heat (250 °C hot plate, 30 seconds) with capacitance change within ±10%, and shelf-life requirements after high-temperature storage.

Typical Applications

  • Automotive Electronics — Suitable for vehicle electronic modules where AEC‑Q200 qualification and +125 °C endurance are required, such as control units and power modules.
  • High‑Temperature Power Supplies — Used for output smoothing and bulk decoupling in power supplies that operate in elevated ambient temperatures.
  • Motor Control and Power Management — Provides stable capacitance and ripple handling for drive circuits and DC‑DC converter outputs in high-temperature environments.
  • Sensor and Telemetry Modules — Offers reliable low-temperature ESR performance and long-term stability for electronics exposed to wide temperature swings.

Unique Advantages

  • Extended high-temperature endurance: Rated for 2000 hours at +125 °C, enabling longer service life in elevated-temperature designs.
  • AEC‑Q200 qualification: Provides an explicit reliability baseline for applications demanding automotive-grade component qualification.
  • Low-temperature ESR characterization: Added ESR specification and measured impedance ratios at −40 °C support predictable behavior in cold-start and low-temperature scenarios.
  • Automated assembly ready: Chip design compatible with carrier tape handling supports high-volume surface-mount pick-and-place production.
  • Compact footprint with robust ripple capability: 100 µF at 25 V in a small L × D package with defined ripple currents (125 mA @120 Hz, 250 mA @10 kHz) balances energy density and thermal management.

Why Choose UCJ1E101MCL1GS?

The UCJ1E101MCL1GS combines a compact surface-mount chip form factor with specifications targeted at high-temperature, high-reliability designs. Its AEC‑Q200 qualification, +125 °C endurance rating and low-temperature ESR specification make it appropriate for engineers designing automotive and other demanding systems that require predictable electrical performance across a wide temperature range.

For designs that require durable bulk capacitance, controlled leakage and verified performance after thermal stress and soldering, this capacitor offers a specification set focused on long-term robustness and automated manufacturing compatibility.

If you would like pricing, availability or a formal quotation for UCJ1E101MCL1GS, please request a quote or submit an inquiry and our team will respond with the required commercial and technical details.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


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