UCJ1E330MCL1GS

CAP ALUM 33UF ±20% 25V SMD
Part Description

33 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,925 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCJ
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance33 µFECCNEAR99
ESRN/AHeight Seated (Max)9 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 125°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 125°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency95 mA @ 10 kHzRipple Current Low Frequency47.5 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension8.7 x 6.3 mmSurface Mount Land Size6.6 x 6.6 mm
Tolerance-20%~20%Voltage25 V

Overview of UCJ1E330MCL1GS – 33 µF, 25 V Chip Aluminum Electrolytic Capacitor

The UCJ1E330MCL1GS is a chip-type aluminum electrolytic capacitor designed for high-reliability, surface-mount applications. Built for operation across a wide temperature range (−40°C to +125°C) and qualified to AEC-Q200, it addresses demanding environments where durability and predictable performance matter.

With low-temperature ESR specification, a compact SMD can package, and endurance validated at elevated temperature, this capacitor is suited for automotive and other high-temperature electronics that require stable capacitance and controlled loss characteristics.

Key Features

  • Capacitance & Voltage — 33 µF rated capacitance at 25 V with ±20% tolerance, providing predictable bulk and decoupling performance in power circuits.
  • Temperature Range & Endurance — Rated for −40°C to +125°C operation and specified for 2000 hours at +125°C, enabling use in high-temperature duty cycles.
  • Low-Temperature ESR Performance — Includes an added ESR specification after −40°C testing to ensure controlled impedance in cold conditions.
  • Ripple Current Ratings — Rated ripple current of 47.5 mA at 120 Hz and 95 mA at 10 kHz to support AC and switching environments within specified limits.
  • Surface-Mount, Automated Assembly Friendly — Chip-type SMD can compatible with carrier-tape feeding for automated placement; package dimensions L: 8.7 × D: 6.3 mm and recommended land size L: 6.6 × W: 6.6 mm.
  • Reliability & Compliance — AEC-Q200 qualified and RoHS compliant, addressing industry reliability and environmental requirements.
  • Polarized Aluminum Electrolytic — Polar construction for use in circuits that require electrolytic bulk capacitance in SMD form factor.

Typical Applications

  • Automotive Electronics — Suited for automotive modules and control units that require AEC-Q200 qualification and operation at elevated temperatures.
  • High-Temperature Electronics — Designed for assemblies and subsystems that must function reliably up to +125°C.
  • Compact SMD Power Decoupling — Provides bulk capacitance and ripple handling in space-constrained surface-mount power rails and converter outputs.

Unique Advantages

  • AEC-Q200 Qualified: Provides an established qualification path for designs targeting automotive-grade reliability.
  • Wide Operating Temperature: −40°C to +125°C rating supports use across harsh thermal environments without sacrificing specified performance.
  • Verified Endurance at Elevated Temperature: Specified 2000 hours at +125°C gives designers quantified lifetime performance for long-term reliability planning.
  • Low-Temperature ESR Specification: ESR characterized after −40°C testing helps ensure predictable impedance in cold-start and low-temperature conditions.
  • Automated Assembly Ready: Chip-type SMD form and carrier-tape compatibility simplify high-volume placement and reduce assembly friction.
  • Regulatory Compliance: RoHS compliance supports use in regulated markets and simplifies environmental compliance efforts.

Why Choose UCJ1E330MCL1GS?

The UCJ1E330MCL1GS combines compact SMD packaging with high-temperature endurance and AEC-Q200 qualification to deliver a reliable electrolytic solution for demanding electronic systems. Its documented low-temperature ESR behavior and ripple current specifications make it suitable where stable bulk capacitance and controlled loss are required across a wide ambient range.

This part is well suited for engineers and procurement teams designing automotive modules, industrial control electronics, and other applications that require dependable performance at elevated temperatures and compatibility with automated surface-mount assembly processes.

Request a quote or submit an inquiry to evaluate UCJ1E330MCL1GS for your design and receive technical and pricing information from the manufacturer’s distribution channel.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


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