UCJ1E470MCL1GS

The UCJ1E470MCL1GS is a chip‑type aluminum electrolytic capacitor in a compact surface‑mount can designed for high‑temperature use. It delivers 47 µF at 25 V with a polarized construction and is intended for applications that require stable capacitance and reliability across a wide temperature range.

Built for automated assembly and long‑term high‑temperature operation, this part targets systems that need robust decoupling and filtering under elevated ambient conditions, with compliance to environmental and reliability standards.

Key Features

• Electrical Characteristics — Rated capacitance 47 µF with tolerance ±20% and rated voltage 25 V, providing a defined solution for mid‑voltage decoupling and smoothing.
• High‑Temperature Performance — Operating temperature range −40 °C to +125 °C and endurance of 2000 hours at 125 °C, enabling sustained operation in elevated temperature environments.
• Low‑Temperature ESR Specification — ESR characteristics are specified after a −40 °C test and low‑temperature impedance ratios are provided in the series datasheet to support performance at cold ambient conditions.
• Ripple Current Ratings — Specified ripple current of 47.5 mA at 120 Hz and 95 mA at 10 kHz, allowing designers to assess ripple handling across low and high frequencies.
• Reliability and Qualification — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), indicating suitability for designs requiring industry-recognized reliability and environmental compliance.
• Surface‑Mount, Assembly‑Friendly Package — Chip can SMD package (L: 8.7 × D: 6.3 mm) compatible with automatic mounting machines fed with carrier tape; recommended land size L: 6.6 × W: 6.6 mm.
• Leakage and Dissipation — Leakage current specified as not more than 0.03CV or 4 µA (whichever is greater) after one minute’s application of rated voltage at 20 °C; tan δ (loss factor) at 120 Hz and 20 °C for 25 V rating is specified (tan δ max. 0.21).

Typical Applications

• Automotive electronic modules — AEC‑Q200 qualification and a −40 °C to +125 °C range make this capacitor suitable for electronic control units and in‑vehicle power modules that require high‑temperature endurance.
• High‑temperature power assemblies — Endurance of 2000 hours at 125 °C and defined ripple current ratings support use in power supply filtering and smoothing in thermally demanding environments.
• Automated surface‑mount production — Chip‑type SMD can packaged for carrier‑tape feeding simplifies integration into automated pick‑and‑place assembly lines.

Unique Advantages

• Validated high‑temperature endurance: 2000 hours at 125 °C provides a measurable reliability baseline for designs exposed to elevated temperatures.
• AEC‑Q200 qualification: Reduces qualification effort for applications that require industry‑recognized component reliability.
• Defined low‑temperature behavior: ESR and impedance specifications after −40 °C testing help ensure predictable performance across the full specified temperature range.
• Compact SMD can package: 47 µF at 25 V in an 8.7 × 6.3 mm footprint minimizes board area while remaining compatible with automated assembly processes.
• Clear electrical limits: Specified leakage current, tan δ, and ripple current values enable straightforward thermal and performance margin calculations.
• RoHS compliant: Meets current environmental directive requirements for electronic products.

Why Choose UCJ1E470MCL1GS?

The UCJ1E470MCL1GS positions itself as a compact, high‑temperature capable aluminum electrolytic solution for designs that demand endurance and predictable behavior from −40 °C to +125 °C. With AEC‑Q200 qualification, defined low‑temperature ESR characteristics, and measurable ripple and leakage specifications, this part supports reliable operation in thermally challenging and automated assembly environments.

This capacitor is well suited for engineers and procurement teams building automotive electronics and other high‑temperature power systems who need a traceable specifications set, durable performance, and assembly compatibility in a small SMD can footprint.

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