UCM0J681MCL1GS

The UCM0J681MCL1GS is a Nichicon chip-type aluminum electrolytic capacitor engineered for surface-mount assembly. It provides 680 µF capacitance at a 6.3 V rating in a compact φ6.3 × 7.7 mm SMD can, optimized for low impedance performance across a wide temperature range.

Designed for demanding environments, this part combines high ripple handling and long-term endurance with AEC-Q200 qualification and RoHS compliance, making it suitable for automotive and other temperature-critical electronic systems.

Key Features

• Capacitance & Tolerance — 680 µF nominal capacitance with ±20% tolerance measured at 120 Hz, 20°C, suitable for bulk energy storage and smoothing in compact layouts.
• Rated Voltage — 6.3 V DC rating for low-voltage power rails and decoupling applications.
• Low Loss / tan δ — tan δ 0.26 (120 Hz, 20°C) for the 6.3 V variant, indicating controlled dissipation at operating frequencies.
• Ripple Current Capability — 300 mA at 120 Hz (low frequency) and 600 mA at 10 kHz (high frequency) to support power-filtering and switching-regulator applications.
• Leakage Current — Specified leakage current of 42.84 µA, measured after rated voltage application, for predictable standby behavior.
• Temperature & Endurance — Operates from −55°C to +105°C with endurance specified as 2000 hours at 105°C for this size class.
• SMD Package & Assembly — Chip-type can in φ6.3 × 7.7 mm format with surface-mount land size 6.6 × 6.6 mm and supplied in embossed carrier taping for automated placement.
• Qualification & Compliance — AEC-Q200 rated and RoHS compliant; product is in mass production.

Typical Applications

• Automotive Electronics — Intended for automotive systems that require an AEC-Q200-qualified SMD capacitor with a −55°C to +105°C range and 2000 h endurance at 105°C.
• Power Supply Filtering — Suited to smoothing and decoupling on low-voltage power rails where 680 µF and multi-hundred milliamp ripple capability are required.
• In-vehicle Modules & Controls — Compact SMD format and embossed carrier taping support automated assembly for control modules and power management boards in vehicle electronics.

Unique Advantages

• Low-impedance performance: Explicit low-impedance chip construction combined with specified tan δ supports efficient AC behavior in smoothing applications.
• High ripple tolerance across frequencies: Rated ripple current of 300 mA (120 Hz) and 600 mA (10 kHz) accommodates both low- and high-frequency switching environments.
• Automotive-grade qualification: AEC-Q200 rating and a −55°C to +105°C operating window make the part suitable for automotive-grade electronic designs.
• Compact SMD package for automated assembly: φ6.3 × 7.7 mm can with embossed carrier taping and a 6.6 × 6.6 mm recommended land pattern simplifies board-level integration and pick-and-place processing.
• Defined endurance and reliability: 2000 hours at 105°C endurance rating for this package size provides predictable long-term behavior under elevated temperature stress.
• Regulatory compliance: RoHS compliance supports applications requiring restricted-substance conformity.

Why Choose UCM0J681MCL1GS?

UCM0J681MCL1GS brings together a high-value combination of capacitance, ripple-handling capability, compact SMD packaging and automotive-oriented qualification. Its defined leakage, tan δ and endurance numbers make it straightforward to evaluate for designs that require reliable bulk capacitance and filtering in temperature-stressed environments.

This part is well suited to engineers and OEMs developing automotive electronics, power modules and compact consumer or industrial systems that need an AEC-Q200-rated SMD electrolytic with automated assembly compatibility and clear, verifiable performance parameters.

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