UCM0J222MNS1GS

The UCM0J222MNS1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a compact surface‑mount can (φ10×10L). It provides 2200 µF capacitance at a rated voltage of 6.3 V with ±20% tolerance and is designed for automated assembly with embossed carrier taping.

Built for demanding thermal and mechanical environments, the part is specified for operation from −55°C to +105°C, offers high ripple current capability, and carries AEC‑Q200 qualification and RoHS compliance for automotive and industrial system use.

Key Features

• Capacitance and Voltage — 2.2 mF (2200 µF) nominal capacitance at a rated voltage of 6.3 V with ±20% tolerance (120 Hz, 20°C).
• Low‑impedance chip construction — Chip type, low impedance design appropriate for surface‑mount power applications.
• Loss tangent (tan δ) — tanδ up to 0.26 measured at 120 Hz, 20°C for 6.3 V parts, enabling predictable AC behavior in filter circuits.
• High ripple current capability — Rated low‑frequency ripple current 595 mA at 120 Hz and high‑frequency ripple current 1.19 A at 10 kHz.
• Leakage current — Measured leakage current 138.6 µA after rated voltage application (product specification).
• High temperature endurance — Rated life of 2000 hours at 105°C (φD ≤ 10), with capacitance and tanδ limits specified after endurance testing.
• Mechanical and assembly attributes — Vibration‑resistant construction in a radial can SMD package (φ10×10L) and supplied in embossed carrier taping for automatic pick‑and‑place.
• Qualification and compliance — AEC‑Q200 qualified and RoHS compliant for regulated environments.

Typical Applications

• Automotive electronics — Suitable for automotive systems that require AEC‑Q200 qualified capacitors, including power conditioning and decoupling on vehicle modules.
• Surface‑mount production — Designed for automated assembly flows; supplied in embossed carrier tape compatible with pick‑and‑place equipment.
• High‑temperature circuits — Used where components must survive sustained temperatures up to 105°C with defined endurance performance.

Unique Advantages

• High capacitance in a compact SMD can — 2200 µF in a φ10×10L package reduces board area compared with larger discrete solutions.
• Designed for automated assembly — Embossed carrier taping and chip‑type package simplify high‑volume surface‑mount production.
• Engineered for thermal reliability — 2000‑hour endurance at 105°C (for φD ≤ 10) provides predictable long‑term performance in elevated temperatures.
• Handles significant ripple — Specified ripple current ratings at both 120 Hz and 10 kHz support smoothing and filtering across frequency ranges.
• Automotive grade and regulatory compliance — AEC‑Q200 qualification and RoHS compliance support regulated product designs.
• Vibration resistant — Mechanical design suited for environments subject to vibration, improving reliability in mobile and industrial applications.

Why Choose UCM0J222MNS1GS?

UCM0J222MNS1GS is positioned for designs that require high capacitance, robust thermal endurance and assembly‑friendly surface‑mount packaging. Its low‑impedance chip construction, measurable ripple handling, and AEC‑Q200 qualification make it appropriate for automotive and industrial applications where predictable electrical and mechanical performance is required.

For engineers and buyers, the part combines compact sizing (φ10×10L), embossed carrier taping for automated placement, and documented endurance at 105°C to help ensure reliable operation over the product lifecycle while maintaining regulatory compliance.

If you would like pricing, availability, or a formal quote for UCM0J222MNS1GS, please request a quote or submit an inquiry to receive ordering and lead‑time information.