UCM1E470MCL1GS

The UCM1E470MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a surface-mount (can-style SMD) package. It delivers 47 µF capacitance at a 25 V rating with specifications targeted for automated assembly and high-temperature operation.

Designed for applications requiring AEC-Q200 qualification, an extended operating temperature range and compact board footprint, this part is suitable for automotive and other demanding electronic systems where reliability and assembly efficiency matter.

Key Features

• Core Electrical 47 µF nominal capacitance with ±20% tolerance and a rated voltage of 25 V; polarized electrolytic construction.
• Low Impedance & Loss Low impedance (360 mΩ) and measured tan δ of 0.14 at 20°C/120 Hz for improved AC performance in filtering and smoothing roles.
• Ripple Current Capability Rated ripple currents of 120 mA at 120 Hz and 240 mA at 10 kHz to support both low- and high-frequency ripple conditions.
• High-Temperature Endurance Rated for operation from −55°C to +105°C with a lifetime of 2000 hours at 105°C.
• Leakage Current Low leakage current specified at 11.75 µA after two minutes at rated voltage and 20°C.
• Package & Assembly Compact φ5 × 5.8 mm case (L: 5.8 × D: 5 mm) in chip/can SMD format with embossed carrier taping for automatic placement; recommended land size L: 5.3 × W: 5.3 mm.
• Qualification & Compliance AEC-Q200 qualification and RoHS compliance for regulated production environments.

Typical Applications

• Automotive Electronics Suitable for automotive electronic modules where AEC-Q200 qualification and 105°C operation support reliability requirements.
• Automated Surface-Mount Assembly Embossed carrier taping and chip-type SMD format enable efficient pick-and-place mounting in high-volume production.
• High-Temperature Electronics Components and subsystems that operate up to 105°C benefit from the capacitor’s rated temperature range and specified endurance.
• Space-Constrained Board Designs Compact φ5 × 5.8 mm package and small recommended land pattern help conserve PCB area in dense layouts.

Unique Advantages

• AEC-Q200 Qualified: Provides qualification suitable for demanding environments, supporting use in automotive-grade designs.
• Measured Low Impedance: 360 mΩ impedance and a tan δ of 0.14 at 120 Hz reduce AC voltage drop and improve filtering performance.
• Wide Operating Temperature: −55°C to +105°C range with a 2000-hour lifetime at 105°C offers predictable endurance in elevated-temperature applications.
• Automated Assembly Ready: Embossed carrier taping and chip-type SMD packaging streamline placement and throughput for mass production.
• Compact Footprint: Small φ5 × 5.8 mm can and a 5.3 × 5.3 mm recommended land size optimize board space for compact designs.
• Low Leakage Current: Specified leakage of 11.75 µA supports reduced standby losses and predictable bias behavior after voltage application.

Why Choose UCM1E470MCL1GS?

The UCM1E470MCL1GS combines low impedance, compact SMD packaging and AEC-Q200 qualification to address demanding production and environmental requirements. Its electrical characteristics—47 µF at 25 V, quantified ripple current ratings and controlled loss angle—make it a practical choice for designers focused on reliable filtering and energy storage in space-constrained and high-temperature systems.

This part is well suited to teams producing high-volume, automated assemblies for automotive and other demanding markets that require documented endurance and RoHS compliance. The combination of assembly-friendly packaging, measured AC performance and temperature endurance delivers predictable behavior over the product life cycle.

If you would like pricing, lead-time information or a formal quote for UCM1E470MCL1GS, please request a quote or contact our sales team for assistance.