UUA1E330MCL1GS

The UUA1E330MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UUA series, offering 33 µF capacitance at a 25 V rating in a compact SMD can (φ6.3 × 5.8 mm). It is designed for surface mounting on high-density PC boards and is supplied in embossed carrier taping for automated assembly and mass production.

Targeted at applications that require long-term reliability in elevated temperatures, this part combines long-life assurance (3000 hours at 105°C), AEC-Q200 qualification, and RoHS compliance to meet demanding system requirements in automotive and other high-reliability environments.

Key Features

• Core Electricals  33 µF capacitance with ±20% tolerance and a 25 V rated voltage for decoupling and bulk energy storage in compact designs.
• Ripple & Leakage Performance  Low-frequency ripple current 50 mA (120 Hz) and high-frequency ripple current 75 mA (10 kHz), with a low leakage current specified at 8.25 µA.
• High-Temperature Endurance  Load life rated at 3000 hours at 105°C, providing long-life performance for high-temperature operating environments.
• Package & Mounting  Chip-type SMD can (φ6.3 × 5.8 mm) with surface-mount land recommendation L: 6.6 × W: 6.6 mm; embossed carrier taping for automated pick-and-place.
• Environmental & Qualification  RoHS compliant and AEC-Q200 qualified, suitable for designs requiring recognized quality and environmental standards.
• Operating Range  Wide operating temperature range from -55°C to 105°C for use across temperature-extreme environments.

Typical Applications

• Automotive Electronics  Suited for automotive electronic modules where AEC-Q200 qualification and elevated temperature endurance are required.
• High‑density Surface-mount PCBs  Designed for surface mounting on compact, high-density boards and compatible with automated assembly via embossed carrier taping.
• Compact Power Modules  Small φ6.3 × 5.8 mm footprint provides capacitance in space-constrained power and filtering circuits.

Unique Advantages

• AEC-Q200 Qualification:  Provides assurance for automotive-grade design cycles and reliability requirements.
• Proven High‑Temperature Life:  3000 hours at 105°C supports long-term operation in hot environments, reducing replacement and maintenance needs.
• Optimized for SMT Production:  Embossed carrier taping and chip SMD format streamline automated handling and reduce assembly cycle time.
• Compact Footprint:  φ6.3 × 5.8 mm package enables integration into space-limited designs without sacrificing capacitance.
• Controlled Leakage and Ripple Ratings:  Low leakage (8.25 µA) plus specified ripple current at 120 Hz and 10 kHz for reliable filtering and decoupling behavior.
• Regulatory Compliance:  RoHS compliant to align with environmental regulations for modern electronic products.

Why Choose UUA1E330MCL1GS?

The UUA1E330MCL1GS balances compact SMD packaging, defined electrical performance, and high-temperature endurance to serve designs that demand durability and automated manufacturing readiness. Its combination of 33 µF/25 V performance, long-life assurance at 105°C, and AEC-Q200 qualification makes it appropriate for engineers developing robust automotive electronics and other high-reliability systems.

This part is suited to design teams and procurement focused on minimizing board space while retaining proven electrolytic capacitance characteristics and production-friendly packaging. Choosing this Nichicon UUA series component supports long-term stability, environmental compliance, and streamlined assembly.

Request a quote or contact sales to discuss availability, pricing, and lead times for UUA1E330MCL1GS.