UUB1V330MCL1GS
| Part Description |
33 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 915 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UUB |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 33 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.7 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 125°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 125°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 66 mA @ 10 kHz | Ripple Current Low Frequency | 44 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 6.2 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UUB1V330MCL1GS – 33 µF, 35 V Chip Aluminum Electrolytic Capacitor, +125°C
The UUB1V330MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UUB series designed for high-temperature operation up to +125°C. It is an AEC-Q200 qualified, RoHS-compliant surface-mount aluminum electrolytic solution intended for demanding environments where temperature endurance and automated assembly are required.
This part is optimized for automatic mounting (carrier-tape fed) and provides a compact SMD can package (L: 6.2 × D: 8 mm) with a defined land pattern, making it suitable for high-reliability power and electronic assemblies in automotive and other high-temperature applications.
Key Features
- Capacitance & Voltage — 33 µF nominal capacitance with a rated voltage of 35 V and ±20% tolerance at 120 Hz, 20°C.
- High Temperature Range — Rated for operation from −40°C to +125°C, with endurance defined for 1000 hours at 125°C for the φ8 × 6.2 size.
- AEC-Q200 Qualified — Series-level AEC-Q200 qualification for applications requiring automotive-grade reliability.
- Surface-Mount, Tape-Fed Packaging — Radial can SMD package designed for automatic mounting machines fed with carrier tape; recommended land size L: 8.3 × W: 8.3 mm.
- Endurance and Soldering Robustness — After 1000 hours at 125°C (for φ8 × 6.2) capacitance change is within ±30%; resistance to soldering heat defined as 30 seconds at 250°C with capacitance change within ±10%.
- Ripple Current Ratings — Rated ripple current of 44 mA at 120 Hz and 66 mA at 10 kHz for the specified part size.
- Regulatory Compliance — Compliant with the RoHS directive (2011/65/EU and (EU)2015/863).
Typical Applications
- Automotive Electronics — Intended for use in AEC-Q200-qualified automotive electronic modules that require operation at elevated temperatures.
- High-Temperature Power Assemblies — Suited to surface-mount assemblies and modules exposed to high board temperatures where components must withstand +125°C.
- Automated Surface-Mount Production — Designed for carrier-tape feeding and automatic mounting in high-volume PCB assembly processes.
Unique Advantages
- High-Temperature Endurance: Engineered for continuous operation up to +125°C with specified 1000-hour endurance for the φ8 × 6.2 size, supporting designs exposed to elevated ambient or board temperatures.
- Automotive-Grade Reliability: AEC-Q200 qualification supports use in systems that require automotive-level component qualification and traceable specifications.
- Assembly-Ready SMD Can: Compact radial can SMD package (6.2 × 8 mm) and defined land pattern simplify layout and automated placement on production lines.
- Defined Endurance and Soldering Performance: Datasheet-specified limits for capacitance change, tan δ, and leakage after endurance and soldering heat tests provide predictable long-term behavior.
- Regulatory Compliance: RoHS compliance facilitates deployment in regulated regions and reduces material compliance risk.
Why Choose UUB1V330MCL1GS?
The UUB1V330MCL1GS combines a compact surface-mount aluminum electrolytic can with high-temperature endurance and AEC-Q200 qualification, making it a practical choice for engineers designing reliable electronics for automotive and other high-temperature environments. Its tape-fed, assembly-ready format and defined land pattern streamline automated production while providing datasheet-backed endurance and soldering robustness.
This part is well suited to designs that need verified performance at elevated temperatures, compact footprint, and industry-standard compliance, delivering predictable behavior over extended high-temperature operation.
Request a quote or contact sales to discuss availability, lead times, and volume pricing for UUB1V330MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016