UUD0J560MCL1GS

The UUD0J560MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly and high-density PCBs. It delivers 56 µF capacitance at a 6.3 V rating in a compact φ5 × 5.8 mm can-style SMD package.

Engineered for low impedance and stable performance across a wide temperature range, this part supports automotive and other demanding electronics applications with AEC-Q200 qualification and RoHS compliance. It is supplied on embossed carrier tape for automated placement in volume production.

Key Features

• Capacitance & Voltage — 56 µF nominal capacitance with ±20% tolerance at a rated voltage of 6.3 V, suitable for low-voltage power applications.
• Low Impedance Performance — Specified impedance of 760 mΩ for effective filtering and decoupling in compact designs.
• Ripple Current Handling — Low-frequency ripple current 150 mA (120 Hz) and high-frequency ripple current 225 mA (10 kHz) to support transient and switching loads.
• Leakage Current — Measured leakage current of 3.528 µA, supporting low-loss operation after application of rated voltage.
• Temperature & Lifetime — Operating temperature range from −55°C to +105°C with endurance rated at 2000 hours at 105°C.
• Package & Assembly — Chip-type radial can SMD, size φ5 × 5.8L, with surface-mount land recommendation 5.3 × 5.3 mm; supplied in embossed carrier taping for automatic pick-and-place.
• Reliability & Compliance — AEC-Q200 qualified and RoHS compliant, suitable for regulated manufacturing environments.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and wide temperature range make this capacitor suitable for control modules and in-vehicle low-voltage circuitry.
• Power Filtering & Decoupling — Low impedance and defined ripple current ratings support smoothing and decoupling on low-voltage power rails.
• High-Density PCB Designs — Chip-type SMD package and embossed carrier taping enable automated placement in space-constrained, high-density assemblies.

Unique Advantages

• Compact SMD Package: φ5 × 5.8 mm can-style chip package saves board space while providing electrolyte capacitance values not available in smaller MLCCs.
• Low Impedance for Stable Filtering: 760 mΩ impedance and high-frequency ripple rating (225 mA at 10 kHz) improve transient suppression in switching power circuits.
• Automated Assembly Ready: Embossed carrier taping supports automatic mounting machines for streamlined manufacturing and consistent placement.
• High-Temperature Endurance: Rated 2000 hours at 105°C, offering predictable lifetime performance in elevated-temperature environments.
• Industry Qualification: AEC-Q200 rating and RoHS compliance provide traceable reliability credentials for regulated and automotive programs.

Why Choose UUD0J560MCL1GS?

The UUD0J560MCL1GS combines low-impedance aluminum electrolytic performance with a compact chip-style SMD package, making it a practical choice for designers needing reliable bulk capacitance and effective ripple handling in constrained board areas. Its AEC-Q200 qualification, extended temperature range, and 2000-hour endurance at 105°C make it appropriate for robust, long-life embedded and automotive electronics.

Supplied for automated assembly and compliant with RoHS requirements, this part suits production environments that demand consistent placement, traceable reliability, and clear electrical performance for low-voltage power systems.

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