UUD1C221MCL1GS

The UUD1C221MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. With a rated capacitance of 220 µF at 16 V and an operating temperature range from -55 °C to +105 °C, it is engineered for demanding environments where compact size and stable performance matter.

Built for automated assembly and compliant with RoHS (2011/65/EU, (EU)2015/863), the device is AEC-Q200 qualified and targets applications that require robust, long-life surface-mount capacitance in compact packages.

Key Features

• Capacitance & Voltage: 220 µF rated at 16 V for mid-voltage bulk and decoupling requirements.
• Low Impedance Design: Specified impedance of 340 mΩ to support low-impedance power rails and transient suppression.
• Temperature Range & Endurance: Rated for -55 °C to +105 °C with a lifetime of 2000 hours at 105 °C (endurance per series specification).
• Ripple Current: 280 mA at 120 Hz and 420 mA at 10 kHz to handle AC ripple in power conversion and regulation circuits.
• Package & Mounting: Chip (radial can) SMD package sized L: 7.7 × D: 6.3 mm, designed for surface mounting on high-density PCBs and compatible with automatic mounting using carrier tape.
• Tolerance & Polarization: Capacitance tolerance ±20% and polarized construction—suitable for DC applications where polarity is defined.
• Electrical Characteristics: Tangent of loss angle (tan δ) max. 0.16 at 16 V (measured at 120 Hz, 20 °C); leakage current after 2 minutes at 20 °C not more than 0.01 CV or 3 µA (whichever is greater).
• Soldering Reliability: Resistance to soldering heat demonstrated (250 °C hot-plate, 30 s) with capacitance change within ±10% and no increase in leakage current beyond initial specification.
• Regulatory & Qualification: RoHS compliant and AEC-Q200 qualified as specified in the product data.

Typical Applications

• Automotive Electronics — Suitable for automotive electronic modules where AEC-Q200 qualification and wide temperature range are required.
• High-density Surface-mount PCBs — Designed for use on compact, densely populated boards where chip-type SMD components are needed.
• Automated Assembly — Applicable to automatic mounting machines fed with carrier tape, enabling streamlined production for volume manufacturing.

Unique Advantages

• Robust AEC-Q200 Qualification: Provides a documented level of reliability appropriate for automotive-grade electronics and other demanding applications.
• High Temperature Endurance: Rated for continuous operation up to +105 °C with a 2000-hour endurance rating at that temperature, supporting designs exposed to elevated ambient conditions.
• Compact SMD Form Factor: Small chip-type package (7.7 × 6.3 mm) reduces board area while enabling placement on high-density PCBs.
• Measured Low Impedance: 340 mΩ impedance supports stable power delivery and effective ripple suppression in power systems.
• Production-friendly: Compatible with carrier-tape automated mounting for efficient, repeatable assembly in mass production.
• Regulatory Compliance: RoHS compliant to meet environmental and materials requirements for global product programs.

Why Choose UUD1C221MCL1GS?

The UUD1C221MCL1GS combines low impedance, compact SMD packaging and automotive-grade qualification to deliver durable capacitance for power management on dense PCBs. Its operating range (-55 °C to +105 °C), specified ripple current, and 2000-hour endurance at 105 °C make it a practical choice for designs that demand reliable bulk or decoupling capacitance in constrained footprints.

This part is well suited for engineers and procurement teams developing automotive or industrial systems that require AEC-Q200-qualified, RoHS-compliant components and efficient assembly with automated equipment.

Request a quote or contact our sales team to discuss availability, lead times and how UUD1C221MCL1GS can fit your next design.