UUG1C102MNQ1MS

The UUG1C102MNQ1MS is a surface-mount aluminum electrolytic capacitor in Nichicon’s UUG series, offering 1000 µF capacitance at a 16 V rating. Engineered for demanding environments, it delivers high capacitance in a compact chip-style can with embossed carrier taping for automated assembly.

With an operating temperature range of −40 °C to 85 °C and AEC-Q200 qualification, this part targets automotive and other applications that require robust SMD capacitance, controlled loss (tan δ), and defined ripple performance over life.

Key Features

• Capacitance & Tolerance — 1000 µF nominal capacitance with tolerance of −20% to +20% (measured at 120 Hz, 20 °C).
• Voltage Rating — Rated for 16 V operation.
• Loss Characteristics (tan δ) — tan δ of 0.20 at 20 °C, 120 Hz, supporting predictable ESR-related behavior in power applications.
• Ripple Current Performance — Low-frequency ripple current of 710 mA (120 Hz) and high-frequency ripple current of 816.5 mA (10 kHz), specified for 85 °C conditions.
• Leakage Current — Leakage current specified at 480 µA (after 1 minute at 20 °C), consistent with the series leakage formula of ≤0.03CV.
• Endurance & Temperature — Life rating of 2000 hours at 85 °C; operating temperature range from −40 °C to 85 °C.
• Package & Mounting — Chip-type radial can SMD, surface-mount configuration with size φ12.5×13.5L and embossed carrier taping for pick-and-place compatibility; recommended PCB land size 1.28 × 1.28 cm.
• Automotive Qualification — Rated AEC-Q200 and identified for automotive applications in product data.

Typical Applications

• Automotive systems — AEC-Q200 rating and −40 °C to 85 °C operation make this capacitor suitable for electronic modules that require stabilized bulk capacitance in automotive environments.
• Surface-mount production — Embossed carrier taping and chip-style SMD can allow efficient integration into automated assembly and reflow workflows.
• Compact power modules — High capacitance in a small package with defined ripple current capacity supports localized energy storage and smoothing in space-constrained designs.

Unique Advantages

• High capacitance in an SMD form factor: 1000 µF provides significant bulk energy storage while maintaining compatibility with surface-mount assembly.
• Automotive-capable qualification: AEC-Q200 rating and a −40 °C to 85 °C range address the reliability expectations of automotive electronics.
• Defined ripple and loss specifications: Specified low- and high-frequency ripple currents plus a measured tan δ allow designers to predict thermal and ESR behavior under load.
• Traceable leakage specification: Leakage current of 480 µA aligns with the series’ ≤0.03CV rule, simplifying verification for power budgets and standby losses.
• Assembly-ready packaging: Embossed carrier taping facilitates automated pick-and-place and throughput in volume manufacturing.

Why Choose UUG1C102MNQ1MS?

The UUG1C102MNQ1MS combines a large 1000 µF capacitance with automotive-oriented qualification and compact SMD packaging, offering a practical solution for designs that need reliable bulk capacitance in constrained footprints. Its clearly specified ripple current, tan δ, and leakage characteristics help engineers model thermal and electrical performance with confidence over a 2000-hour endurance at 85 °C.

This part is well suited to customers designing automotive electronic modules and other applications that require AEC-Q200 qualification, robust temperature performance, and pick-and-place friendly packaging. It provides verifiable, specification-driven value for projects that prioritize predictable power filtering and energy storage in a board-level SMD component.

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