GYC1E561MNZ1GS
| Part Description |
560 µF 25 V ±20% Hybrid Polymer Aluminum Capacitor, SMD |
|---|---|
| Quantity | 1,350 Available (as of November 3, 2026) |
| Product Category | Aluminum - Polymer Capacitors |
|---|---|
| Part Series | GYC |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 560 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 12 mOhm @ 100 kHz | Height Seated (Max) | 1.7 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 4000 h @ 135°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 135°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Unknown | Ripple Current High Frequency | 2.9 A @ 100 kHz | Ripple Current Low Frequency | 435 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 16.5 x 10 mm | Surface Mount Land Size | 10.3 x 10.3 mm | ||
| Tolerance | -20%~20% | Voltage | 25 V |
Overview of GYC1E561MNZ1GS – Surface‑Mount Conductive Polymer Hybrid Aluminum Electrolytic Capacitor, 25 V, 560 µF
The GYC1E561MNZ1GS from Nichicon is a surface‑mount conductive polymer hybrid aluminum electrolytic capacitor rated 560 µF at 25 V. Built for high‑temperature, long‑life operation, it is designed for applications that require low ESR and high ripple handling in compact SMD form factors.
Key market segments include automotive electronic systems and other electronics deployed in elevated temperature environments, where the combination of AEC‑Q200 qualification, extended endurance at 135°C, and embossed carrier taping for automated assembly add practical value.
Key Features
- Capacitance & Voltage — 560 µF nominal capacitance with a rated voltage of 25 V and a tolerance of ±20% (at 120 Hz, 20°C).
- Conductive polymer hybrid construction — Hybrid polymer design for high reliability with low ESR and strong ripple performance.
- Low ESR — ESR of 12 mΩ measured at 100 kHz and 20°C, supporting efficient power delivery and reduced losses in high‑frequency circuits.
- High ripple current capability — Low‑frequency ripple current 435 mA (120 Hz) and high‑frequency ripple current 2.9 A (100 kHz) for demanding power applications.
- High‑temperature endurance — Rated for operation from −55°C to +135°C with an endurance of 4000 hours at 135°C under rated conditions.
- Loss factor (tan δ) — tan δ of 0.14 (20°C, 120 Hz) at the 25 V rating, suitable for predictable AC behavior at typical measurement conditions.
- Leakage current — Specified leakage current of 140 µA.
- Surface‑mount package — Radial can SMD package, size φ10 × 16.5 L, supplied in embossed carrier taping for pick‑and‑place assembly.
- Automotive‑grade reliability — AEC‑Q200 qualification and RoHS compliance, supporting regulated and high‑reliability deployments.
Typical Applications
- Automotive electronic systems — For power supply decoupling and smoothing in modules that require AEC‑Q200 qualification and extended high‑temperature endurance.
- High‑temperature electronics — Suited to assemblies that operate at elevated ambient temperatures up to 135°C and require sustained performance over long life.
- Surface‑mount power assemblies — Designed for automated SMT production using embossed carrier taping, enabling compact power and filtering implementations.
Unique Advantages
- High ripple handling in a compact SMD — Combines low ESR (12 mΩ at 100 kHz) with high ripple current capability (2.9 A at 100 kHz) to support robust power filtering in space‑constrained boards.
- Long life at elevated temperature — Endurance of 4000 hours at 135°C provides predictable longevity for designs exposed to high thermal stress.
- Automotive‑grade qualification — AEC‑Q200 rating supports use in regulated automotive electronic systems where qualification is required.
- Manufacturing‑friendly packaging — Embossed carrier taping simplifies pick‑and‑place for high‑volume surface‑mount assembly.
- Predictable AC characteristics — Specified tan δ and temperature impedance ratios support engineering characterization across frequency and temperature.
- Regulatory compliance — RoHS compliant for use in designs targeting restricted‑substance conformity.
Why Choose GYC1E561MNZ1GS?
GYC1E561MNZ1GS positions itself as a reliable, high‑temperature SMD capacitor choice where low ESR, strong ripple capability, and long endurance are required. Its conductive polymer hybrid construction, AEC‑Q200 qualification, and specified performance metrics make it well suited to engineers designing for automotive electronics and other high‑temperature, high‑reliability applications.
For teams focused on long‑term robustness and automated assembly, the combination of embossed carrier taping, compact radial can SMD packaging, and clear electrical specifications delivers a practical, verifiable component option supported by Nichicon’s GYC series design heritage.
If you would like pricing, lead‑time information, or to request a formal quote for GYC1E561MNZ1GS, please submit a quote request or contact sales to discuss availability and technical details.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016