PCG0J331MCL1GS
| Part Description |
330 µF 6.3 V ±20% Polymer Aluminum Capacitor, SMD |
|---|---|
| Quantity | 1,621 Available (as of November 3, 2026) |
| Product Category | Aluminum - Polymer Capacitors |
|---|---|
| Part Series | PCG |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 330 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 23 mOhm @ 100 kHz | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 2.7 A @ 100 kHz | Ripple Current Low Frequency | 1.35 A @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 6 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of PCG0J331MCL1GS – Conductive Polymer Aluminum Solid Electrolytic Chip, 330 µF, 6.3 V
The PCG0J331MCL1GS from Nichicon is a conductive‑polymer aluminum solid electrolytic chip capacitor delivering 330 µF at a rated voltage of 6.3 V in a compact surface‑mount can (φ6.3 × 6L). It is designed for high‑capacitance, low‑impedance decoupling and bulk energy storage in space‑constrained assemblies.
With low ESR, high ripple current capability, a wide operating temperature range and AEC‑Q200 rating, this SMD capacitor is targeted at demanding electronics applications where reliable power smoothing and long‑term stability are required.
Key Features
- Capacitance & Voltage — 330 µF nominal capacitance with a ±20% tolerance at 120 Hz, 20°C; rated for 6.3 V operation.
- Low ESR — ESR of 23 mΩ measured at 20°C / 100 kHz, supporting low‑loss operation and improved transient response.
- High Ripple Current — Rated ripple current of 2.7 A at 105°C / 100 kHz and 1.35 A at 120 Hz, enabling effective filtering in high‑frequency power stages.
- Temperature & Reliability — Operating range −55°C to +105°C with endurance specified as 2000 hours at 105°C under rated voltage; meets AEC‑Q200 requirements.
- Leakage & Loss — Leakage current specified at 416 µA after 2 minutes at 20°C; tan δ = 0.12 at 120 Hz, 20°C for predictable dielectric loss.
- Package & Assembly — Chip SMD can package (φ6.3 × 6L) with recommended surface‑mount land size 6.6 × 6.6 mm; supplied in embossed carrier taping with moisture‑proof packing for automated placement.
- Soldering Heat Resistance — Meets soldering heat resistance conditions described in the datasheet (preheat 150–200°C, controlled peak durations), supporting standard reflow processes within the specified profile limits.
Typical Applications
- Power Supply Decoupling — Low ESR and high ripple current make it suitable for bulk and output filtering on DC‑DC converters and power rails.
- Automotive Electronics — AEC‑Q200 rating and −55°C to +105°C range support use in automotive control modules and in‑vehicle power systems.
- High‑Frequency Power Stages — 23 mΩ ESR at 100 kHz and 2.7 A ripple rating enable effective smoothing in high‑frequency switching environments.
- Compact Consumer & Industrial Boards — High capacitance in a φ6.3 × 6 mm SMD can for space‑limited designs requiring reliable bulk energy storage.
Unique Advantages
- High Capacitance in a Small Footprint: 330 µF in a φ6.3 × 6L package reduces board area for bulk capacitance requirements.
- Low Loss, Fast Response: 23 mΩ ESR and tan δ = 0.12 at 120 Hz deliver low dissipation and improved transient performance for sensitive power rails.
- Robust Ripple Handling: Rated ripple current up to 2.7 A at 100 kHz supports demanding switching converter outputs and high‑frequency filtering.
- Automotive‑Grade Reliability: AEC‑Q200 rating plus endurance of 2000 hours at 105°C under rated voltage provide predictable long‑term behavior in harsh environments.
- Pick‑and‑Place Ready Packaging: Embossed carrier taping with moisture‑proof packing simplifies high‑volume assembly and protects parts during storage.
- Defined Soldering Profile Compliance: Specified soldering heat resistance criteria allow integration into controlled reflow processes within the datasheet limits.
Why Choose PCG0J331MCL1GS?
PCG0J331MCL1GS is positioned for designs that require a balance of high capacitance, low ESR and robust ripple capability in a compact SMD can. Its conductive‑polymer construction and detailed endurance and soldering specifications offer designers measurable performance and assembly compatibility.
This part is ideal for engineers developing power delivery subsystems in automotive, industrial and compact consumer electronics who need predictable long‑term stability and automated assembly packaging. The combination of AEC‑Q200 qualification, wide temperature range and defined endurance provides a clear reliability profile for demanding applications.
Request a quote or submit an inquiry to our sales team for pricing, lead times and volume packaging options for PCG0J331MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016