PCG1A561MCL1GS

The PCG1A561MCL1GS is a surface-mount conductive polymer aluminum solid electrolytic capacitor offering 560 µF capacitance at a 10 V rated voltage. It combines high capacitance density in a compact φ10 × 8 mm can-style SMD package for space-constrained designs.

Engineered for automotive environments, the device carries an AEC-Q200 rating and provides a broad operating temperature range of −55 °C to +105 °C, making it suitable for demanding power-management and decoupling roles where long endurance and stable electrical performance are required.

Key Features

• Capacitance & tolerance — 560 µF nominal with ±20% tolerance (measured at 120 Hz, 20 °C), providing predictable bulk capacitance for power systems.
• Rated voltage — 10 V DC rating suitable for low-voltage automotive and embedded power rails.
• Low ESR & high ripple capability — ESR of 20 mΩ at 100 kHz with ripple current ratings of 1.8 A at 120 Hz and 3.6 A at 100 kHz, supporting both low- and high-frequency ripple handling.
• Leakage & dissipation — Leakage current specified at 1120 µA and tan δ (DF) of 0.12 measured at 20 °C, 120 Hz, enabling predictable loss and self-heating characteristics.
• Temperature and endurance — Operates from −55 °C to +105 °C with endurance of 2000 hours at 105 °C under rated voltage, meeting long-term stability requirements.
• Automotive qualification — Built to AEC-Q200 requirements and identified for automotive applications in the product data.
• Compact SMD package & packaging — φ10 × 8 mm can-style SMD (radial can) with embossed carrier tape and moisture-proof packing for automated placement and handling.

Typical Applications

• Automotive electronics — Designed for use in automotive modules where AEC-Q200 qualification and a −55 °C to +105 °C operating range are required.
• Automotive power rails — Low ESR (20 mΩ) combined with 1.8 A (120 Hz) and 3.6 A (100 kHz) ripple capability supports smoothing and decoupling on vehicle power supplies.
• Embedded and module power systems — Compact φ10 × 8 mm surface-mount form factor provides high capacitance density for space-limited power management circuits in automotive and related embedded designs.

Unique Advantages

• High capacitance in a compact SMD can — 560 µF in a φ10 × 8 mm package delivers substantial bulk capacitance while minimizing board area.
• Strong ripple-handling performance — Specified ripple currents at both 120 Hz and 100 kHz enable reliable operation across low- and high-frequency power domains.
• Low ESR for reduced losses — 20 mΩ ESR at 100 kHz lowers conduction losses and improves power conversion efficiency where applied.
• Qualified for automotive environments — AEC-Q200 rating and elevated temperature endurance (2000 h at 105 °C) support long-term reliability in vehicle systems.
• Predictable electrical behavior — Specified tan δ and leakage current values provide clear parameters for thermal and power-loss budgeting.
• Manufacturing-ready packaging — Embossed carrier taping with moisture-proof packing facilitates automated assembly and handling.

Why Choose PCG1A561MCL1GS?

PCG1A561MCL1GS is positioned for designs that require high capacitance density, robust ripple handling, and automotive-capable reliability in a compact surface-mount can package. Its combination of 560 µF capacitance, 10 V rating, low ESR (20 mΩ at 100 kHz), and AEC-Q200 qualification makes it well suited to automotive power rails and embedded power-management modules that demand long endurance and stable performance up to +105 °C.

For engineers and procurement teams, this part delivers measurable electrical parameters (leakage current, tan δ, ESR, ripple current) and standardized packaging to simplify BOM decisions and accelerate production-ready assembly.

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