PCM1D331MCL1GS

CAP ALUM POLY 330UF ±20% 20V SMD
Part Description

330 µF 20 V ±20% Polymer Aluminum Capacitor, SMD

Quantity 1,569 Available (as of November 3, 2026)
Product CategoryAluminum - Polymer Capacitors
Part SeriesPCM
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance330 µFECCNEAR99
ESR23 mOhm @ 100 kHzHeight Seated (Max)8.5 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp8000 h @ 125°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 125°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency2 A @ 100 kHzRipple Current Low Frequency1 A @ 120 Hz
RoHS ComplianceCompliantSize / Dimension8 x 10 mmSurface Mount Land Size10.3 x 10.3 mm
Tolerance-20%~20%Voltage20 V

Overview of PCM1D331MCL1GS – Conductive Polymer Aluminum Solid Electrolytic Capacitor, 330 µF, 20 V

The PCM1D331MCL1GS is a chip-type conductive polymer aluminum solid electrolytic capacitor in Nichicon’s PCM series. It combines low equivalent series resistance and high ripple-current capability with an extended high-temperature lifetime, making it suitable for demanding electronic power circuits.

Designed for surface-mount assembly and rated for operation from -55°C to 125°C, this AEC-Q200 qualified, RoHS-compliant capacitor addresses applications that require durability at elevated temperatures and robust electrical performance.

Key Features

  • Conductive polymer chemistry  Solid polymer electrolyte construction delivers high reliability along with inherently low ESR and strong ripple-current handling.
  • Capacitance and voltage  330 µF nominal capacitance at a 20 V rated voltage with ±20% tolerance for stable bulk storage in power rails.
  • Low ESR and high ripple current  ESR specified at 23 mΩ (100 kHz); ripple current rated up to 2 A at 100 kHz and 1 A at 120 Hz to support high-frequency power stages.
  • High-temperature endurance  Long-life rating of 8000 hours at 125°C, with temperature range from -55°C to 125°C for sustained elevated-temperature operation.
  • AEC-Q200 qualified and RoHS compliant  Meets AEC-Q200 qualification and the RoHS directive (2011/65/EU, (EU)2015/863) for applications requiring automotive-grade reliability and environmental compliance.
  • SMD-ready package and reflow  Chip-type, radial can SMD package designed for lead-free reflow soldering with a 260°C peak allowance; recommended land size L: 1.03 × W: 1.03 cm.
  • Endurance and soldering robustness  Per datasheet endurance: capacitance change within ±20% after 8000 hours at 125°C; resistance-to-soldering-heat limits include capacitance change within ±10% under specified profiles.
  • Compact footprint  Case dimensions L: 0.8 × D: 1 cm for integration into space-constrained power assemblies.

Typical Applications

  • Automotive electronics  Suited for automotive power modules and control units that require AEC-Q200 qualification and long-term operation at elevated temperatures.
  • Power conversion modules  Bulk smoothing and decoupling in DC–DC converters and regulator outputs where low ESR and high ripple capability are needed.
  • Industrial controls  Power-stage filtering in industrial embedded systems exposed to high ambient temperatures and continuous operation.
  • High-reliability embedded systems  Applications requiring sustained capacitance and stability over extended high-temperature lifetimes.

Unique Advantages

  • Long high-temperature service life:  8000 hours at 125°C provides predictable aging and extended maintenance intervals for high-temperature applications.
  • High ripple handling with low losses:  23 mΩ ESR at 100 kHz combined with 2 A ripple-current rating at 100 kHz enables efficient filtering in high-frequency power paths.
  • Automotive-grade qualification:  AEC-Q200 qualification supports deployment in automotive systems requiring validated component reliability.
  • Reflow-compatible SMD design:  Chip-type SMD package supports lead-free reflow processes up to 260°C peak for modern assembly workflows.
  • Compact, defined footprint:  Small case dimensions and specified land pattern simplify board layout in space-constrained designs.

Why Choose PCM1D331MCL1GS?

The PCM1D331MCL1GS is positioned for designs that demand a combination of low ESR, high ripple-current capability, and proven high-temperature endurance. Its conductive polymer chemistry and AEC-Q200 qualification make it appropriate for engineers targeting long-life, high-reliability power subsystems—especially in automotive and industrial environments.

By offering measurable specifications for ESR, ripple current, temperature range, and endurance, the PCM1D331MCL1GS helps reduce design risk and supports consistent performance over time, simplifying component selection for robust power management designs.

Request a quote or submit an inquiry to obtain pricing and availability for the PCM1D331MCL1GS. Our team can provide lead-time and ordering details to support your design schedule.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


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