PCM1E331MCL1GS

The PCM1E331MCL1GS is a conductive polymer aluminum solid electrolytic chip capacitor designed for surface-mount applications that require high reliability and long-term performance in elevated temperatures. This SMD, polarized capacitor delivers 330 µF at 25 V with a broad operating temperature range of -55 °C to 125 °C and an endurance rating of 8000 hours at 125 °C.

Engineered for demanding environments, the PCM series offers low equivalent series resistance (ESR), high ripple current capability and lead-free reflow compatibility, making it suitable for compact power modules and assemblies where thermal and electrical durability are essential.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance at a rated voltage of 25 V; capacitance tolerance ±20% at 120 Hz, 20 °C.
• High Temperature Range — Rated operating temperature from -55 °C to +125 °C with endurance specified at 8000 hours at 125 °C.
• Low ESR — Specified ESR of 20 mΩ at 100 kHz, supporting efficient current handling and reduced dissipation.
• High Ripple Current — 1.25 A at 120 Hz and 2.5 A at 100 kHz to support power smoothing and decoupling under dynamic loads.
• SMD, Lead-Free Reflow Compatible — Chip-type, surface-mount can construction designed for lead-free reflow soldering up to a 260 °C peak (profile compliant).
• AEC-Q200 Qualified — Electrical component qualification listed for AEC-Q200, indicating suitability for demanding electronic applications.
• Robust Endurance & Stability — After rated-voltage endurance (8000 h at 125 °C) and damp-heat testing, capacitance, tan δ and ESR remain within specified limits; ESR verified down to -40 °C after endurance.
• Packaging and PCB Land Size — Compact chip footprint with body dimensions approximately 10 mm × 10 mm and recommended PCB land size 10.3 mm × 10.3 mm for surface-mount assembly.
• RoHS Compliant — Conforms to RoHS directive requirements (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suitable for use in vehicle electronic modules where AEC-Q200 qualification and high-temperature endurance are required.
• Power Conversion and Regulation — Provides bulk capacitance and low ESR for DC–DC converters and power-supply filtering in compact assemblies.
• High-Reliability Embedded Systems — Ideal for board-level decoupling and energy storage in industrial or other harsh-environment electronics operating at elevated temperatures.
• Surface-Mount Power Modules — Designed for SMT integration with lead-free reflow profiles, supporting modern automated assembly processes.

Unique Advantages

• Extended High-Temperature Life: 8000 hours at 125 °C provides predictable long-term performance in elevated-temperature systems.
• Low Power Loss: 20 mΩ ESR at 100 kHz minimizes dissipation and improves efficiency in high-frequency power applications.
• High Ripple Handling: Rated ripple currents (1.25 A at 120 Hz; 2.5 A at 100 kHz) support dynamic load conditions and reduce voltage ripple.
• Assembly-Ready SMD Form Factor: Chip-type can and land-size recommendations simplify PCB layout and surface-mount production with lead-free reflow compatibility.
• Qualified Reliability: AEC-Q200 qualification and post-endurance ESR/temperature performance verification support deployment in demanding electronic designs.
• Regulatory Compliance: RoHS conformity helps meet environmental and compliance requirements for modern electronics manufacturing.

Why Choose PCM1E331MCL1GS?

The PCM1E331MCL1GS combines conductive polymer aluminum capacitor performance with a compact SMD chip form factor optimized for high-temperature, high-reliability electronics. Its combination of high capacitance (330 µF), low ESR (20 mΩ at 100 kHz), and validated endurance at 125 °C make it well suited to power conversion, filtering, and energy-storage roles where thermal and electrical robustness are critical.

This part is appropriate for engineers designing compact, thermally demanding assemblies—especially where AEC-Q200 qualification and lead-free reflow compatibility are required. Its stable performance over long-duration thermal stress and damp-heat conditions delivers predictable behavior across the product lifecycle.

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