A3P060-1FGG144I

The A3P060-1FGG144I is a ProASIC3 series flash-based FPGA providing 1,536 logic elements and approximately 60,000 gates in a compact surface-mount BGA package. It integrates 18,432 bits of on-chip RAM and 96 I/O pins, delivering a moderate-capacity, reconfigurable logic resource for embedded designs.

Designed for industrial applications, this device operates from a 1.425 V to 1.575 V core supply and supports an operating temperature range of -40 °C to 100 °C, making it suitable for systems that require reliable operation across a wide temperature span.

Key Features

• Core Logic  Contains 1,536 logic elements (LEs) and approximately 60,000 gates to implement custom digital functions and state machines.
• Embedded Memory  Includes 18,432 bits of on-chip RAM to support buffering, small LUT-storage, and control-state data.
• I/O Capacity  Provides 96 general-purpose I/O pins for peripheral interfacing, signal routing, and board-level connectivity.
• Power Supply  Operates on a defined core voltage range of 1.425 V to 1.575 V for deterministic power planning.
• Package & Mounting  Supplied in a 144-LBGA package (supplier device package: 144-FPBGA, 13×13) for surface-mount PCB assembly and compact board footprint.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet environmental demands in industrial systems.
• Compliance  RoHS compliant.

Typical Applications

• Embedded Logic and Control  Implement custom control algorithms, glue logic, and finite-state machines using the device's 1,536 logic elements and on-chip RAM.
• Interface and I/O Expansion  Use the 96 I/O pins to bridge peripherals, expand digital interfaces, or aggregate signals on space-constrained PCBs.
• Industrial Systems  Deploy in industrial control and monitoring equipment that requires operation across -40 °C to 100 °C and surface-mount packaging.

Unique Advantages

• Moderate logic capacity: 1,536 logic elements and ~60,000 gates provide a balance between functionality and cost for mid-range FPGA designs.
• On-chip memory: 18,432 bits of embedded RAM reduce dependence on external memory for small buffers and state storage.
• High I/O count: 96 I/Os enable flexible peripheral connectivity and signal routing without extensive external glue logic.
• Industrial reliability: Specified operating range of -40 °C to 100 °C supports robust operation in demanding thermal environments.
• Compact surface-mount package: 144-LBGA (144-FPBGA, 13×13) minimizes board area while supporting modern SMT assembly processes.
• Manufacturing-friendly compliance: RoHS compliance facilitates integration into environmentally constrained production programs.

Why Choose A3P060-1FGG144I?

The A3P060-1FGG144I offers a practical combination of logic resources, embedded memory, and I/O density in a compact industrial-grade package. Its defined core voltage range and wide operating temperature make it suitable for designers targeting reliable, reconfigurable logic in embedded and industrial applications.

This device is well suited for projects that require moderate FPGA capacity with a focus on deterministic supply planning, on-chip storage, and substantial I/O capability while maintaining a small PCB footprint.

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